SPRSP19 December   2017 TMS320F28377D-EP

PRODUCTION DATA.  

  1. 1Device Overview
    1. 1.1 Features
    2. 1.2 Applications
    3. 1.3 Description
    4. 1.4 Functional Block Diagram
  2. 2Revision History
  3. 3Terminal Configuration and Functions
    1. 3.1 Pin Diagrams
    2. 3.2 Signal Descriptions
    3. 3.3 Pins With Internal Pullup and Pulldown
    4. 3.4 Pin Multiplexing
      1. 3.4.1 GPIO Muxed Pins
      2. 3.4.2 Input X-BAR
      3. 3.4.3 Output X-BAR and ePWM X-BAR
      4. 3.4.4 USB Pin Muxing
      5. 3.4.5 High-Speed SPI Pin Muxing
    5. 3.5 Connections for Unused Pins
  4. 4Specifications
    1. 4.1  Absolute Maximum Ratings
    2. 4.2  ESD Ratings
    3. 4.3  Recommended Operating Conditions
    4. 4.4  Power Consumption Summary
      1. 4.4.1 Current Consumption Graphs
      2. 4.4.2 Reducing Current Consumption
    5. 4.5  Electrical Characteristics
    6. 4.6  Thermal Resistance Characteristics
      1. 4.6.1 GWT Package
      2. 4.6.2 PTP Package
    7. 4.7  System
      1. 4.7.1 Power Sequencing
      2. 4.7.2 Reset Timing
        1. 4.7.2.1 Reset Sources
        2. 4.7.2.2 Reset Electrical Data and Timing
      3. 4.7.3 Clock Specifications
        1. 4.7.3.1 Clock Sources
        2. 4.7.3.2 Clock Frequencies, Requirements, and Characteristics
          1. 4.7.3.2.1 Input Clock Frequency and Timing Requirements, PLL Lock Times
          2. 4.7.3.2.2 Internal Clock Frequencies
          3. 4.7.3.2.3 Output Clock Frequency and Switching Characteristics
        3. 4.7.3.3 Input Clocks and PLLs
        4. 4.7.3.4 Crystal Oscillator
        5. 4.7.3.5 Internal Oscillators
      4. 4.7.4 Flash Parameters
      5. 4.7.5 Emulation/JTAG
        1. 4.7.5.1 JTAG Electrical Data and Timing
      6. 4.7.6 GPIO Electrical Data and Timing
        1. 4.7.6.1 GPIO - Output Timing
        2. 4.7.6.2 GPIO - Input Timing
        3. 4.7.6.3 Sampling Window Width for Input Signals
      7. 4.7.7 Interrupts
        1. 4.7.7.1 External Interrupt (XINT) Electrical Data and Timing
      8. 4.7.8 Low-Power Modes
        1. 4.7.8.1 Clock-Gating Low-Power Modes
        2. 4.7.8.2 Power-Gating Low-Power Modes
        3. 4.7.8.3 Low-Power Mode Wakeup Timing
      9. 4.7.9 External Memory Interface (EMIF)
        1. 4.7.9.1 Asynchronous Memory Support
        2. 4.7.9.2 Synchronous DRAM Support
        3. 4.7.9.3 EMIF Electrical Data and Timing
          1. 4.7.9.3.1 Asynchronous RAM
          2. 4.7.9.3.2 Synchronous RAM
    8. 4.8  Analog Peripherals
      1. 4.8.1 Analog-to-Digital Converter (ADC)
        1. 4.8.1.1 ADC Electrical Data and Timing
          1. 4.8.1.1.1 ADC Input Models
          2. 4.8.1.1.2 ADC Timing Diagrams
        2. 4.8.1.2 Temperature Sensor Electrical Data and Timing
      2. 4.8.2 Comparator Subsystem (CMPSS)
        1. 4.8.2.1 CMPSS Electrical Data and Timing
      3. 4.8.3 Buffered Digital-to-Analog Converter (DAC)
        1. 4.8.3.1 Buffered DAC Electrical Data and Timing
    9. 4.9  Control Peripherals
      1. 4.9.1 Enhanced Capture (eCAP)
        1. 4.9.1.1 eCAP Electrical Data and Timing
      2. 4.9.2 Enhanced Pulse Width Modulator (ePWM)
        1. 4.9.2.1 Control Peripherals Synchronization
        2. 4.9.2.2 ePWM Electrical Data and Timing
          1. 4.9.2.2.1 Trip-Zone Input Timing
        3. 4.9.2.3 External ADC Start-of-Conversion Electrical Data and Timing
      3. 4.9.3 Enhanced Quadrature Encoder Pulse (eQEP)
        1. 4.9.3.1 eQEP Electrical Data and Timing
      4. 4.9.4 High-Resolution Pulse Width Modulator (HRPWM)
        1. 4.9.4.1 HRPWM Electrical Data and Timing
      5. 4.9.5 Sigma-Delta Filter Module (SDFM)
        1. 4.9.5.1 SDFM Electrical Data and Timing
    10. 4.10 Communications Peripherals
      1. 4.10.1 Controller Area Network (CAN)
      2. 4.10.2 Inter-Integrated Circuit (I2C)
        1. 4.10.2.1 I2C Electrical Data and Timing
      3. 4.10.3 Multichannel Buffered Serial Port (McBSP)
        1. 4.10.3.1 McBSP Electrical Data and Timing
          1. 4.10.3.1.1 McBSP Transmit and Receive Timing
          2. 4.10.3.1.2 McBSP as SPI Master or Slave Timing
      4. 4.10.4 Serial Communications Interface (SCI)
      5. 4.10.5 Serial Peripheral Interface (SPI)
        1. 4.10.5.1 SPI Electrical Data and Timing
          1. 4.10.5.1.1 Non-High-Speed Master Mode Timings
          2. 4.10.5.1.2 Non-High-Speed Slave Mode Timings
          3. 4.10.5.1.3 High-Speed Master Mode Timings
          4. 4.10.5.1.4 High-Speed Slave Mode Timings
      6. 4.10.6 Universal Serial Bus (USB) Controller
        1. 4.10.6.1 USB Electrical Data and Timing
      7. 4.10.7 Universal Parallel Port (uPP) Interface
        1. 4.10.7.1 uPP Electrical Data and Timing
  5. 5Detailed Description
    1. 5.1  Overview
    2. 5.2  Functional Block Diagram
    3. 5.3  Memory
      1. 5.3.1 C28x Memory Map
      2. 5.3.2 Flash Memory Map
      3. 5.3.3 EMIF Chip Select Memory Map
      4. 5.3.4 Peripheral Registers Memory Map
      5. 5.3.5 Memory Types
        1. 5.3.5.1 Dedicated RAM (Mx and Dx RAM)
        2. 5.3.5.2 Local Shared RAM (LSx RAM)
        3. 5.3.5.3 Global Shared RAM (GSx RAM)
        4. 5.3.5.4 CPU Message RAM (CPU MSGRAM)
        5. 5.3.5.5 CLA Message RAM (CLA MSGRAM)
    4. 5.4  Identification
    5. 5.5  Bus Architecture - Peripheral Connectivity
    6. 5.6  C28x Processor
      1. 5.6.1 Floating-Point Unit
      2. 5.6.2 Trigonometric Math Unit
      3. 5.6.3 Viterbi, Complex Math, and CRC Unit II (VCU-II)
    7. 5.7  Control Law Accelerator
    8. 5.8  Direct Memory Access
    9. 5.9  Interprocessor Communication Module
    10. 5.10 Boot ROM and Peripheral Booting
      1. 5.10.1 EMU Boot or Emulation Boot
      2. 5.10.2 WAIT Boot Mode
      3. 5.10.3 Get Mode
      4. 5.10.4 Peripheral Pins Used by Bootloaders
    11. 5.11 Dual Code Security Module
    12. 5.12 Timers
    13. 5.13 Nonmaskable Interrupt With Watchdog Timer (NMIWD)
    14. 5.14 Watchdog
    15. 5.15 Configurable Logic Block (CLB)
  6. 6Applications, Implementation, and Layout
    1. 6.1 TI Design or Reference Design
  7. 7Device and Documentation Support
    1. 7.1 Device and Development Support Tool Nomenclature
    2. 7.2 Tools and Software
    3. 7.3 Device Nomenclature
    4. 7.4 Documentation Support
    5. 7.5 Community Resources
    6. 7.6 Trademarks
    7. 7.7 Electrostatic Discharge Caution
    8. 7.8 Export Control Notice
    9. 7.9 Glossary
  8. 8Mechanical, Packaging, and Orderable Information
    1. 8.1 Via Channel
    2. 8.2 Packaging Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7 Device and Documentation Support

TI offers an extensive line of development tools. Tools and software to evaluate the performance of the device, generate code, and develop solutions are listed below.

7.1 Device and Development Support Tool Nomenclature

To designate the stages in the product development cycle, TI assigns prefixes to the part numbers of all TMS320™ MCU devices and support tools. Each TMS320 MCU commercial family member has one of three prefixes: TMX, TMP, or TMS (for example, TMS320F28379D). Texas Instruments recommends two of three possible prefix designators for its support tools: TMDX and TMDS. These prefixes represent evolutionary stages of product development from engineering prototypes (with TMX for devices and TMDX for tools) through fully qualified production devices and tools (with TMS for devices and TMDS for tools).

Device development evolutionary flow:

TMX Experimental device that is not necessarily representative of the final device's electrical specifications
TMP Final silicon die that conforms to the device's electrical specifications but has not completed quality and reliability verification
TMS Fully qualified production device

Support tool development evolutionary flow:

TMDX Development-support product that has not yet completed Texas Instruments internal qualification testing
TMDS Fully qualified development-support product

TMX and TMP devices and TMDX development-support tools are shipped against the following disclaimer:
"Developmental product is intended for internal evaluation purposes."

TMS devices and TMDS development-support tools have been characterized fully, and the quality and reliability of the device have been demonstrated fully. TI's standard warranty applies.

Predictions show that prototype devices (TMX or TMP) have a greater failure rate than the standard production devices. Texas Instruments recommends that these devices not be used in any production system because their expected end-use failure rate still is undefined. Only qualified production devices are to be used.

TI device nomenclature also includes a suffix with the device family name. This suffix indicates the package type (for example, PTP) and temperature range (for example, T). Figure 7-1 provides a legend for reading the complete device name for any family member.

For device part numbers and further ordering information, see the TI website (www.ti.com) or contact your TI sales representative.

For additional description of the device nomenclature markings on the die, see the TMS320F2837xD Dual-Core Delfino™ MCUs Silicon Errata.

TMS320F28377D-EP nomen_sprsp19.gif Figure 7-1 Device Nomenclature

7.2 Tools and Software

TI offers an extensive line of development tools. Some of the tools and software to evaluate the performance of the device, generate code, and develop solutions are listed below. To view all available tools and software for C2000™ real-time control MCUs, visit the C2000 MCU Tools and Software page.

Development Tools

F28379D controlCARD for C2000 Real time control development kits
The Delfino F28379D controlCARD from Texas Instruments is Position Manager-ready and an ideal product for initial software development and short run builds for system prototypes, test stands, and many other projects that require easy access to high-performance controllers. All C2000 controlCARDs are complete board-level modules that utilize a HSEC180 or DIMM100 form factor to provide a low-profile single-board controller solution. The host system needs to provide only a single 5V power rail to the controlCARD for it to be fully functional.

F28379D Delfino Experimenter Kit
C2000™ MCU Experimenter Kits provide a robust hardware prototyping platform for real-time, closed loop control development with Texas Instruments C2000 32-bit microcontroller family. This platform is a great tool to customize and prove-out solutions for many common power electronics applications, including motor control, digital power supplies, solar inverters, digital LED lighting, precision sensing, and more.

Software Tools

C2000Ware for C2000 MCUs
C2000Ware for C2000 microcontrollers is a cohesive set of development software and documentation designed to minimize software development time. From device-specific drivers and libraries to device peripheral examples, C2000Ware provides a solid foundation to begin development and evaluation. C2000Ware is now the recommended content delivery tool versus controlSUITE™.

controlSUITE™ Software Suite
controlSUITE™ for C2000 microcontrollers is a cohesive set of software infrastructure and software tools designed to minimize software development time.

Code Composer Studio™ (CCS) Integrated Development Environment (IDE) for C2000 Microcontrollers
Code Composer Studio is an integrated development environment (IDE) that supports TI's Microcontroller and Embedded Processors portfolio. Code Composer Studio comprises a suite of tools used to develop and debug embedded applications. It includes an optimizing C/C++ compiler, source code editor, project build environment, debugger, profiler, and many other features. The intuitive IDE provides a single user interface taking the user through each step of the application development flow. Familiar tools and interfaces allow users to get started faster than ever before. Code Composer Studio combines the advantages of the Eclipse software framework with advanced embedded debug capabilities from TI resulting in a compelling feature-rich development environment for embedded developers.

Pin Mux Tool
The Pin Mux Utility is a software tool which provides a Graphical User Interface for configuring pin multiplexing settings, resolving conflicts and specifying I/O cell characteristics for TI MPUs.

F021 Flash Application Programming Interface (API)
The F021 Flash Application Programming Interface (API) provides a software library of functions to program, erase, and verify F021 on-chip Flash memory.

Training

To help assist design engineers in taking full advantage of the C2000 microcontroller features and performance, TI has developed a variety of training resources. Utilizing the online training materials and downloadable hands-on workshops provides an easy means for gaining a complete working knowledge of the C2000 microcontroller family. These training resources have been designed to decrease the learning curve, while reducing development time, and accelerating product time to market. For more information on the various training resources, visit the Support and training for C2000™ real-time control MCUs site.

Specific F2837xD/F2837xS/F2807x hands-on training resources can be found at the following sites:

7.3 Device Nomenclature

To designate the stages in the product development cycle, TI assigns prefixes to the part numbers of all microprocessors (MPUs) and support tools. Each device has one of three prefixes: X, P, or null (no prefix) (for example, your device). Texas Instruments recommends two of three possible prefix designators for its support tools: TMDX and TMDS. These prefixes represent evolutionary stages of product development from engineering prototypes (TMDX) through fully qualified production devices and tools (TMDS).

Device development evolutionary flow:

    X Experimental device that is not necessarily representative of the final device's electrical specifications and may not use production assembly flow.
    P Prototype device that is not necessarily the final silicon die and may not necessarily meet final electrical specifications.
    nullProduction version of the silicon die that is fully qualified.

Support tool development evolutionary flow:

    TMDX Development-support product that has not yet completed Texas Instruments internal qualification testing.
    TMDS Fully-qualified development-support product.

X and P devices and TMDX development-support tools are shipped against the following disclaimer:

To designate the stages in the product development cycle, TI assigns prefixes to the part numbers of all DSP devices and support tools. Each DSP commercial family member has one of three prefixes: TMX, TMP, or TMS (for example, your device). Texas Instruments recommends two of three possible prefix designators for its support tools: TMDX and TMDS. These prefixes represent evolutionary stages of product development from engineering prototypes (TMX and TMDX) through fully qualified production devices and tools (TMS and TMDS).

Device development evolutionary flow:

    TMX Experimental device that is not necessarily representative of the final device's electrical specifications and may not use production assembly flow.
    TMP Prototype device that is not necessarily the final silicon die and may not necessarily meet final electrical specifications.
    TMSProduction version of the silicon die that is fully qualified.

Support tool development evolutionary flow:

    TMDX Development-support product that has not yet completed Texas Instruments internal qualification testing.
    TMDS Fully-qualified development-support product.

TMX and TMP devices and TMDX development-support tools are shipped against the following disclaimer:

"Developmental product is intended for internal evaluation purposes."

Production devices and TMDS development-support tools have been characterized fully, and the quality and reliability of the device have been demonstrated fully. TI's standard warranty applies.

Predictions show that prototype devices (X or P) have a greater failure rate than the standard production devices. Texas Instruments recommends that these devices not be used in any production system because their expected end-use failure rate still is undefined. Only qualified production devices are to be used.

TI device nomenclature also includes a suffix with the device family name. This suffix indicates the package type (for example, your package), the temperature range (for example, blank is the default commercial temperature range), and the device speed range, in megahertz (for example, your device speed range). Figure 7-2 provides a legend for reading the complete device name for any your device device.

For orderable part numbers of your device devices in the your package package types, see the Package Option Addendum of this document, ti.com, or contact your TI sales representative.

For additional description of the device nomenclature markings on the die, see the Silicon Errata.

Figure 7-2 Device Nomenclature

7.4 Documentation Support

To receive notification of documentation updates, navigate to the device product folder on ti.com. In the upper right corner, click on Alert me to register and receive a weekly digest of any product information that has changed. For change details, review the revision history included in any revised document.

The current documentation that describes the processor, related peripherals, and other technical collateral is listed below.

Errata

TMS320F2837xD Dual-Core Delfino™ MCUs Silicon Errata describes known advisories on silicon and provides workarounds.

Technical Reference Manual

TMS320F2837xD Dual-Core Delfino Microcontrollers Technical Reference Manual details the integration, the environment, the functional description, and the programming models for each peripheral and subsystem in the 2837xD microcontrollers.

CPU User's Guides

TMS320C28x CPU and Instruction Set Reference Guide describes the central processing unit (CPU) and the assembly language instructions of the TMS320C28x fixed-point digital signal processors (DSPs). This Reference Guide also describes emulation features available on these DSPs.

TMS320C28x Extended Instruction Sets Technical Reference Manual describes the architecture, pipeline, and instruction set of the TMU, VCU-II, and FPU accelerators.

Peripheral Guides

C2000 Real-Time Control Peripherals Reference Guide describes the peripheral reference guides of the 28x DSPs.

Tools Guides

TMS320C28x Assembly Language Tools v17.6.0.STS User's Guide describes the assembly language tools (assembler and other tools used to develop assembly language code), assembler directives, macros, common object file format, and symbolic debugging directives for the TMS320C28x device.

TMS320C28x Optimizing C/C++ Compiler v17.6.0.STS User's Guide describes the TMS320C28x C/C++ compiler. This compiler accepts ANSI standard C/C++ source code and produces TMS320 DSP assembly language source code for the TMS320C28x device.

TMS320C28x Instruction Set Simulator Technical Overview describes the simulator, available within the Code Composer Studio for TMS320C2000 IDE, that simulates the instruction set of the C28x core.

Application Reports

Semiconductor Packing Methodology describes the packing methodologies employed to prepare semiconductor devices for shipment to end users.

Calculating Useful Lifetimes of Embedded Processors provides a methodology for calculating the useful lifetime of TI embedded processors (EPs) under power when used in electronic systems. It is aimed at general engineers who wish to determine if the reliability of the TI EP meets the end system reliability requirement.

Getting Started With TMS320C28x Digital Signal Controllers provides tips on getting started with TMS320C28x DSP software and hardware development to aid in initial design and debug efforts.

7.5 Community Resources

The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use.

    TI E2E™ Online Community The TI engineer-to-engineer (E2E) community was created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers.
    TI Embedded Processors Wiki Established to help developers get started with Embedded Processors from Texas Instruments and to foster innovation and growth of general knowledge about the hardware and software surrounding these devices.

7.6 Trademarks

PowerPAD, Delfino, TMS320C2000, C2000, controlSUITE, Code Composer Studio, TMS320, E2E are trademarks of Texas Instruments.

Bosch is a registered trademark of Robert Bosch GmbH Corporation.

7.7 Electrostatic Discharge Caution

esds-image

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.

7.8 Export Control Notice

Recipient agrees to not knowingly export or re-export, directly or indirectly, any product or technical data (as defined by the U.S., EU, and other Export Administration Regulations) including software, or any controlled product restricted by other applicable national regulations, received from disclosing party under nondisclosure obligations (if any), or any direct product of such technology, to any destination to which such export or re-export is restricted or prohibited by U.S. or other applicable laws, without obtaining prior authorization from U.S. Department of Commerce and other competent Government authorities to the extent required by those laws.

7.9 Glossary

    TI Glossary This glossary lists and explains terms, acronyms, and definitions.