SCBS881F january   2010  – june 2023 TMS3705

PRODUCTION DATA  

  1.   1
  2. Features
  3. Applications
  4. Description
  5. Functional Block Diagram
  6. Revision History
  7. Device Characteristics
    1. 6.1 Related Products
  8. Terminal Configuration and Functions
    1. 7.1 Pin Diagram
    2. 7.2 Signal Descriptions
  9. Specifications
    1. 8.1 Absolute Maximum Ratings #GUID-D01738F0-6DD5-4A5A-BE33-2BC076228CBE/AMR001
    2. 8.2 ESD Ratings
    3. 8.3 Recommended Operating Conditions
    4. 8.4 Electrical Characteristics
    5. 8.5 Thermal Resistance Characteristics for D (SOIC) Package
    6. 8.6 Switching Characteristics
    7. 8.7 Timing Diagrams
  10. Detailed Description
    1. 9.1  Power Supply
    2. 9.2  Oscillator
    3. 9.3  Predrivers
    4. 9.4  Full Bridge
    5. 9.5  RF Amplifier
    6. 9.6  Band-Pass Filter and Limiter
    7. 9.7  Diagnosis
    8. 9.8  Power-on Reset
    9. 9.9  Frequency Divider
    10. 9.10 Digital Demodulator
    11. 9.11 Transponder Resonance-Frequency Measurement
    12. 9.12 SCI Encoder
    13. 9.13 Control Logic
    14. 9.14 Test Pins
  11. 10Applications, Implementation, and Layout
    1. 10.1 Application Diagram
  12. 11Device and Documentation Support
    1. 11.1 Getting Started and Next Steps
    2. 11.2 Device Nomenclature
    3. 11.3 Tools and Software
    4. 11.4 Documentation Support
    5. 11.5 Support Resources
    6. 11.6 Trademarks
    7. 11.7 Electrostatic Discharge Caution
    8. 11.8 Glossary
  13. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Applications, Implementation, and Layout

Note:

Information in the following applications sections is not part of the TI component specification, and TI does not warrant its accuracy or completeness. TI’s customers are responsible for determining suitability of components for their purposes, as well as validating and testing their design implementation to confirm system functionality.