SPNS141G August   2010  – October 2018 TMS570LS10106 , TMS570LS10116 , TMS570LS10206 , TMS570LS20206 , TMS570LS20216

PRODUCTION DATA.  

  1. 1 TMS570LS Series 16/32-BIT RISC Flash Microcontroller
    1. 1.1 Features
    2. 1.2 Description
    3. 1.3 Functional Block Diagram
  2. 2 Device Overview
    1. 2.1 Terms and Acronyms
    2. 2.2 Device Characteristics
    3. 2.3 Memory
      1. 2.3.1 Memory Map
      2. 2.3.2 Flash Memory
      3. 2.3.3 System Modules Assignment
      4. 2.3.4 Peripheral Selects
      5. 2.3.5 Memory Auto-Initialization
      6. 2.3.6 PBIST RAM Self Test
    4. 2.4 Pin Assignments
      1. 2.4.1 PGE QFP Package Pinout (144 pin)
      2. 2.4.2 ZWT BGA Package Pinout (337 ball)
    5. 2.5 Terminal Functions
    6. 2.6 Device Support
      1. 2.6.1 Device and Development-Support Tool Nomenclature
  3. 3 Reset / Abort Sources
    1. 3.1 Reset / Abort Sources
  4. 4 Peripherals
    1. 4.1  Error Signaling Module (ESM)
    2. 4.2  Direct Memory Access (DMA)
    3. 4.3  High End Timer Transfer Unit (HET-TU)
    4. 4.4  Vectored Interrupt Manager (VIM)
    5. 4.5  MIBADC Event Trigger Sources
    6. 4.6  MIBSPI
      1. 4.6.1 MIBSPI Event Trigger Sources
      2. 4.6.2 MIBSPIP5/DMM Pin Multiplexing
    7. 4.7  ETM
    8. 4.8  Debug Scan Chains
      1. 4.8.1 JTAG
    9. 4.9  CCM
      1. 4.9.1 Dual Core Implementation
      2. 4.9.2 CCM-R4
    10. 4.10 LPM
    11. 4.11 Voltage Monitor
    12. 4.12 CRC
    13. 4.13 System Module Access
    14. 4.14 Debug ROM
    15. 4.15 CPU Self Test Controller: STC / LBIST
  5. 5 Device Registers
    1. 5.1 Device Identification Code Register
      1. Table 5-1 Device ID Bit Allocation Register Field Descriptions
    2. 5.2 Die-ID Registers
    3. 5.3 PLL Registers
  6. 6 Device Electrical Specifications
    1. 7 Operating Conditions
      1. 7.1 Absolute Maximum Ratings Over Operating Free-Air Temperature Range (unless otherwise noted)
      2. 7.2 Device Recommended Operating Conditions
      3. 7.3 Electrical Characteristics Over Operating Free-Air Temperature Range
  7. 8 Peripheral and Electrical Specifications
    1. 8.1  Clocks
      1. 8.1.1 PLL And Clock Specifications
      2. 8.1.2 External Reference Resonator/Crystal Oscillator Clock Option
      3. 8.1.3 Validated FMPLL Setting
      4. 8.1.4 LPO And Clock Detection
      5. 8.1.5 Switching Characteristics Over Recommended Operating Conditions For Clocks
        1. 8.1.5.1 Timing - Wait States
    2. 8.2  ECLK Specification
      1. 8.2.1 Switching Characteristics Over Recommended Operating Conditions For External Clocks
    3. 8.3  RST And PORRST Timings
      1. 8.3.1 Timing Requirements For PORRST
      2. 8.3.2 Switching Characteristics Over Recommended Operating Conditions For RST
      3. 8.3.3 IO Status During PORRST
    4. 8.4  TEST Pin Timing
    5. 8.5  DAP - JTAG Scan Interface Timing
      1. 8.5.1 JTAG clock specification 12-MHz and 50-pF load on TDO output
    6. 8.6  Output Timings
      1. 8.6.1 Switching Characteristics For Output Timings Versus Load Capacitance (CL)
    7. 8.7  Input Timings
      1. 8.7.1 Timing Requirements For Input Timings
    8. 8.8  Flash Timings
    9. 8.9  SPI Master Mode Timing Parameters
      1. 8.9.1 SPI Master Mode External Timing Parameters (CLOCK PHASE = 0, SPICLK = output, SPISIMO = output, and SPISOMI = input)
      2. 8.9.2 SPI Master Mode External Timing Parameters (CLOCK PHASE = 1, SPICLK = output, SPISIMO = output, and SPISOMI = input)
    10. 8.10 SPI Slave Mode Timing Parameters
      1. 8.10.1 SPI Slave Mode External Timing Parameters (CLOCK PHASE = 0, SPICLK = input, SPISIMO = input, and SPISOMI = output)
      2. 8.10.2 SPI Slave Mode External Timing Parameters (CLOCK PHASE = 1, SPICLK = input, SPISIMO = input, and SPISOMI = output)
    11. 8.11 CAN Controller Mode Timings
      1. 8.11.1 Dynamic Characteristics For The CANnTX And CANnRX Pins
    12. 8.12 SCI/LIN Mode Timings
    13. 8.13 FlexRay Controller Mode Timings
      1. 8.13.1 Jitter Timing
    14. 8.14 EMIF Timings
      1. 8.14.1 Read Timing (Asynchronous RAM)
      2. 8.14.2 Write Timing (Asynchronous RAM)
    15. 8.15 ETM Timings
      1. 8.15.1 ETMTRACECLK Timing
      2. 8.15.2 ETMDATA Timing
    16. 8.16 RTP Timings
      1. 8.16.1 RTPCLK Timing
      2. 8.16.2 RTPDATA Timing
      3. 8.16.3 RTPENABLE Timing
    17. 8.17 DMM Timings
      1. 8.17.1 DMMCLK Timing
      2. 8.17.2 DMMDATA Timing
      3. 8.17.3 DMMENA Timing
    18. 8.18 MibADC
      1. 8.18.1 MibADC
      2. 8.18.2 MibADC Recommended Operating Conditions
      3. 8.18.3 Operating Characteristics Over Full Ranges Of Recommended Operating Conditions
      4. 8.18.4 MibADC Input Model
      5. 8.18.5 MibADC Timings
      6. 8.18.6 MibADC Nonlinearity Error
      7. 8.18.7 MibADC Total Error
  8. 9 Revision History
  9. 10Mechanical Packaging and Orderable Information
    1. 10.1 Thermal Data
      1. 10.1.1 PGE (S-PQFP-G144) plastic Quad Flat Pack
      2. 10.1.2 ZWT (S-PBGA-N337) Plastic ball grid array
    2. 10.2 Packaging Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • ZWT|337
  • PGE|144
Thermal pad, mechanical data (Package|Pins)
Orderable Information

2.3.2 Flash Memory

The F035 (130nm Flash Process) Flash memory is a nonvolatile electrically erasable and programmable memory. The Flash has a state machine for simplifying the program and erase functions.

This device’s 2M-Byte flash memory contains four 512K-Byte memory arrays (or banks) consisting of 22 total sectors. 1M-Byte versions of the device contain only the first two 512K-Byte banks (Bank 0 and Bank 1) and have a total of 14 sectors. The bank and sector configurations are shown in Flash Memory Banks and Sectors . When in pipeline mode, the Flash operates with a system clock frequency of up to 160MHz (versus a system clock in non-pipeline mode of up to 36MHz). The flash in pipeline mode is capable of accessing 128 bits at a time and provides two 64-bit pipelined words to the CPU. The minimum size for an erase operation is one sector. A single program operation can program either one 32-bit word or one 16-bit half word at a time.

Table 2-3 Flash Memory Banks and Sectors

Sector NO. Segment Low Address High address MEMORY ARRAYS (OR BANKS)
Bank 0: 512K Bytes
0 32K Bytes 0x0000_0000 0x0000_7FFF BANK0 (512K Bytes)
1 32K Bytes 0x0000_8000 0x0000_FFFF
2 32K Bytes 0x0001_0000 0x0001_7FFF
3 8K Bytes 0x0001_8000 0x0001_9FFF
4 8K Bytes 0x0001_A000 0x0001_BFFF
5 16K Bytes 0x0001_C000 0x0001_FFFF
6 64K Bytes 0x0002_0000 0x0002_FFFF
7 64K Bytes 0x0003_0000 0x0003_FFFF
8 128K Bytes 0x0004_0000 0x0005_FFFF
9 128K Bytes 0x0006_0000 0x0007_FFFF
Bank 1: 512K Bytes
0 128K Bytes 0x0008_0000 0x0009_FFFF BANK1 (512K Bytes)
1 128K Bytes 0x000A_0000 0x000B_FFFF
2 128K Bytes 0x000C_0000 0x000D_FFFF
3 128K Bytes 0x000E_0000 0x000F_FFFF
Bank 2: 512K Bytes
0 128K Bytes 0x0010_0000 0x0011_FFFF BANK2 (512K Bytes)
1 128K Bytes 0x0012_0000 0x0013_FFFF
2 128K Bytes 0x0014_0000 0x0015_FFFF
3 128K Bytes 0x0016_0000 0x0017_FFFF
Bank 3: 512K Bytes
0 128K Bytes 0x0018_0000 0x0019_FFFF BANK3 (512k Bytes)
1 128K Bytes 0x001A_0000 0x001B_FFFF
2 128K Bytes 0x001C_0000 0x001D_FFFF
3 128K Bytes 0x001E_0000 0x001F_FFFF

NOTE

  • The external flash pump voltage (VccP) is required for all flash operations (program, erase, and read).
  • After a system reset, pipeline mode is disabled (FRDCNTL[2:0] is a "000"). In other words, the device powers up and comes out of reset in non-pipeline mode.
  • The user must program proper ECC bits throughout the entire flash memory to avoid ECC errors due to Cortex R4 speculative fetches if flash ECC is enabled.
  • The flash on this device does not support EEPROM emulation.