SPNS141G August   2010  – October 2018 TMS570LS10106 , TMS570LS10116 , TMS570LS10206 , TMS570LS20206 , TMS570LS20216

PRODUCTION DATA.  

1. 1 TMS570LS Series 16/32-BIT RISC Flash Microcontroller
   1. 1.1 Features
   2. 1.2 Description
   3. 1.3 Functional Block Diagram
2. 2 Device Overview
   1. 2.1 Terms and Acronyms
   2. 2.2 Device Characteristics
   3. 2.3 Memory
      1. 2.3.1 Memory Map
      2. 2.3.2 Flash Memory
      3. 2.3.3 System Modules Assignment
      4. 2.3.4 Peripheral Selects
      5. 2.3.5 Memory Auto-Initialization
      6. 2.3.6 PBIST RAM Self Test
   4. 2.4 Pin Assignments
      1. 2.4.1 PGE QFP Package Pinout (144 pin)
      2. 2.4.2 ZWT BGA Package Pinout (337 ball)
   5. 2.5 Terminal Functions
   6. 2.6 Device Support
      1. 2.6.1 Device and Development-Support Tool Nomenclature
3. 3 Reset / Abort Sources
   1. 3.1 Reset / Abort Sources
4. 4 Peripherals
   1. 4.1  Error Signaling Module (ESM)
   2. 4.2  Direct Memory Access (DMA)
   3. 4.3  High End Timer Transfer Unit (HET-TU)
   4. 4.4  Vectored Interrupt Manager (VIM)
   5. 4.5  MIBADC Event Trigger Sources
   6. 4.6  MIBSPI
      1. 4.6.1 MIBSPI Event Trigger Sources
      2. 4.6.2 MIBSPIP5/DMM Pin Multiplexing
   7. 4.7  ETM
   8. 4.8  Debug Scan Chains
      1. 4.8.1 JTAG
   9. 4.9  CCM
      1. 4.9.1 Dual Core Implementation
      2. 4.9.2 CCM-R4
   10. 4.10 LPM
   11. 4.11 Voltage Monitor
   12. 4.12 CRC
   13. 4.13 System Module Access
   14. 4.14 Debug ROM
   15. 4.15 CPU Self Test Controller: STC / LBIST
5. 5 Device Registers
   1. 5.1 Device Identification Code Register
      1. Table 5-1 Device ID Bit Allocation Register Field Descriptions
   2. 5.2 Die-ID Registers
   3. 5.3 PLL Registers
6. 6 Device Electrical Specifications
   1. 7 Operating Conditions
      1. 7.1 Absolute Maximum Ratings Over Operating Free-Air Temperature Range (unless otherwise noted)
      2. 7.2 Device Recommended Operating Conditions
      3. 7.3 Electrical Characteristics Over Operating Free-Air Temperature Range
7. 8 Peripheral and Electrical Specifications
   1. 8.1  Clocks
      1. 8.1.1 PLL And Clock Specifications
      2. 8.1.2 External Reference Resonator/Crystal Oscillator Clock Option
      3. 8.1.3 Validated FMPLL Setting
      4. 8.1.4 LPO And Clock Detection
      5. 8.1.5 Switching Characteristics Over Recommended Operating Conditions For Clocks
         1. 8.1.5.1 Timing - Wait States
   2. 8.2  ECLK Specification
      1. 8.2.1 Switching Characteristics Over Recommended Operating Conditions For External Clocks
   3. 8.3  RST And PORRST Timings
      1. 8.3.1 Timing Requirements For PORRST
      2. 8.3.2 Switching Characteristics Over Recommended Operating Conditions For RST
      3. 8.3.3 IO Status During PORRST
   4. 8.4  TEST Pin Timing
   5. 8.5  DAP - JTAG Scan Interface Timing
      1. 8.5.1 JTAG clock specification 12-MHz and 50-pF load on TDO output
   6. 8.6  Output Timings
      1. 8.6.1 Switching Characteristics For Output Timings Versus Load Capacitance (CL)
   7. 8.7  Input Timings
      1. 8.7.1 Timing Requirements For Input Timings
   8. 8.8  Flash Timings
   9. 8.9  SPI Master Mode Timing Parameters
      1. 8.9.1 SPI Master Mode External Timing Parameters (CLOCK PHASE = 0, SPICLK = output, SPISIMO = output, and SPISOMI = input)
      2. 8.9.2 SPI Master Mode External Timing Parameters (CLOCK PHASE = 1, SPICLK = output, SPISIMO = output, and SPISOMI = input)
   10. 8.10 SPI Slave Mode Timing Parameters
       1. 8.10.1 SPI Slave Mode External Timing Parameters (CLOCK PHASE = 0, SPICLK = input, SPISIMO = input, and SPISOMI = output)
       2. 8.10.2 SPI Slave Mode External Timing Parameters (CLOCK PHASE = 1, SPICLK = input, SPISIMO = input, and SPISOMI = output)
   11. 8.11 CAN Controller Mode Timings
       1. 8.11.1 Dynamic Characteristics For The CANnTX And CANnRX Pins
   12. 8.12 SCI/LIN Mode Timings
   13. 8.13 FlexRay Controller Mode Timings
       1. 8.13.1 Jitter Timing
   14. 8.14 EMIF Timings
       1. 8.14.1 Read Timing (Asynchronous RAM)
       2. 8.14.2 Write Timing (Asynchronous RAM)
   15. 8.15 ETM Timings
       1. 8.15.1 ETMTRACECLK Timing
       2. 8.15.2 ETMDATA Timing
   16. 8.16 RTP Timings
       1. 8.16.1 RTPCLK Timing
       2. 8.16.2 RTPDATA Timing
       3. 8.16.3 RTPENABLE Timing
   17. 8.17 DMM Timings
       1. 8.17.1 DMMCLK Timing
       2. 8.17.2 DMMDATA Timing
       3. 8.17.3 DMMENA Timing
   18. 8.18 MibADC
       1. 8.18.1 MibADC
       2. 8.18.2 MibADC Recommended Operating Conditions
       3. 8.18.3 Operating Characteristics Over Full Ranges Of Recommended Operating Conditions
       4. 8.18.4 MibADC Input Model
       5. 8.18.5 MibADC Timings
       6. 8.18.6 MibADC Nonlinearity Error
       7. 8.18.7 MibADC Total Error
8. 9 Revision History
9. 10Mechanical Packaging and Orderable Information
   1. 10.1 Thermal Data
      1. 10.1.1 PGE (S-PQFP-G144) plastic Quad Flat Pack
      2. 10.1.2 ZWT (S-PBGA-N337) Plastic ball grid array
   2. 10.2 Packaging Information