SPNS162C April   2012  – April 2015 TMS570LS3137

PRODUCTION DATA.  

  1. 1Device Overview
    1. 1.1 Features
    2. 1.2 Applications
    3. 1.3 Description
    4. 1.4 Functional Block Diagram
  2. 2Revision History
  3. 3Device Comparison
  4. 4Terminal Configuration and Functions
    1. 4.1 PGE QFP Package Pinout (144-Pin)
    2. 4.2 ZWT BGA Package Ball-Map (337-Ball Grid Array)
    3. 4.3 Terminal Functions
      1. 4.3.1 PGE Package
        1. 4.3.1.1  Multibuffered Analog-to-Digital Converters (MibADCs)
        2. 4.3.1.2  Enhanced High-End Timer (N2HET) Modules
        3. 4.3.1.3  General-Purpose Input/Output (GPIO)
        4. 4.3.1.4  FlexRay Interface Controller (FlexRay)
        5. 4.3.1.5  Controller Area Network Controllers (DCANs)
        6. 4.3.1.6  Local Interconnect Network Interface Module (LIN)
        7. 4.3.1.7  Standard Serial Communication Interface (SCI)
        8. 4.3.1.8  Inter-Integrated Circuit Interface Module (I2C)
        9. 4.3.1.9  Standard Serial Peripheral Interface (SPI)
        10. 4.3.1.10 Multibuffered Serial Peripheral Interface Modules (MibSPI)
        11. 4.3.1.11 Ethernet Controller
        12. 4.3.1.12 System Module Interface
        13. 4.3.1.13 Clock Inputs and Outputs
        14. 4.3.1.14 Test and Debug Modules Interface
        15. 4.3.1.15 Flash Supply and Test Pads
        16. 4.3.1.16 Supply for Core Logic: 1.2-V Nominal
        17. 4.3.1.17 Supply for I/O Cells: 3.3-V Nominal
        18. 4.3.1.18 Ground Reference for All Supplies Except VCCAD
      2. 4.3.2 ZWT Package
        1. 4.3.2.1  Multibuffered Analog-to-Digital Converters (MibADCs)
        2. 4.3.2.2  Enhanced High-End Timer (N2HET) Modules
        3. 4.3.2.3  General-Purpose Input/Output (GPIO)
        4. 4.3.2.4  FlexRay Interface Controller (FlexRay)
        5. 4.3.2.5  Controller Area Network Controllers (DCANs)
        6. 4.3.2.6  Local Interconnect Network Interface Module (LIN)
        7. 4.3.2.7  Standard Serial Communication Interface (SCI)
        8. 4.3.2.8  Inter-Integrated Circuit Interface Module (I2C)
        9. 4.3.2.9  Standard Serial Peripheral Interface (SPI)
        10. 4.3.2.10 Multibuffered Serial Peripheral Interface Modules (MibSPI)
        11. 4.3.2.11 Ethernet Controller
        12. 4.3.2.12 External Memory Interface (EMIF)
        13. 4.3.2.13 Embedded Trace Macrocell for Cortex-R4F CPU (ETM-R4F)
        14. 4.3.2.14 RAM Trace Port (RTP)
        15. 4.3.2.15 Data Modification Module (DMM)
        16. 4.3.2.16 System Module Interface
        17. 4.3.2.17 Clock Inputs and Outputs
        18. 4.3.2.18 Test and Debug Modules Interface
        19. 4.3.2.19 Flash Supply and Test Pads
        20. 4.3.2.20 No Connects
        21. 4.3.2.21 Supply for Core Logic: 1.2-V Nominal
        22. 4.3.2.22 Supply for I/O Cells: 3.3-V Nominal
        23. 4.3.2.23 Ground Reference for All Supplies Except VCCAD
  5. 5Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Power-On Hours (POH)
    4. 5.4  Recommended Operating Conditions
    5. 5.5  Switching Characteristics for Clock Domains
    6. 5.6  Wait States Required
    7. 5.7  Power Consumption
    8. 5.8  Input/Output Electrical Characteristics
    9. 5.9  Thermal Resistance Characteristics
    10. 5.10 Output Buffer Drive Strengths
    11. 5.11 Input Timings
    12. 5.12 Output Timings
    13. 5.13 Low-EMI Output Buffers
  6. 6System Information and Electrical Specifications
    1. 6.1  Device Power Domains
    2. 6.2  Voltage Monitor Characteristics
      1. 6.2.1 Important Considerations
      2. 6.2.2 Voltage Monitor Operation
      3. 6.2.3 Supply Filtering
    3. 6.3  Power Sequencing and Power On Reset
      1. 6.3.1 Power-Up Sequence
      2. 6.3.2 Power-Down Sequence
      3. 6.3.3 Power-On Reset: nPORRST
        1. 6.3.3.1 nPORRST Electrical and Timing Requirements
    4. 6.4  Warm Reset (nRST)
      1. 6.4.1 Causes of Warm Reset
      2. 6.4.2 nRST Timing Requirements
    5. 6.5  ARM-R4F CPU Information
      1. 6.5.1 Summary of ARM Cortex-R4F CPU Features
      2. 6.5.2 ARM Cortex-R4F CPU Features Enabled by Software
      3. 6.5.3 Dual Core Implementation
      4. 6.5.4 Duplicate Clock Tree After GCLK
      5. 6.5.5 ARM Cortex-R4F CPU Compare Module (CCM-R4) for Safety
      6. 6.5.6 CPU Self-Test
        1. 6.5.6.1 Application Sequence for CPU Self-Test
        2. 6.5.6.2 CPU Self-Test Clock Configuration
        3. 6.5.6.3 CPU Self-Test Coverage
    6. 6.6  Clocks
      1. 6.6.1 Clock Sources
        1. 6.6.1.1 Main Oscillator
          1. 6.6.1.1.1 Timing Requirements for Main Oscillator
        2. 6.6.1.2 Low Power Oscillator
          1. 6.6.1.2.1 Features
          2. 6.6.1.2.2 LPO Electrical and Timing Specifications
        3. 6.6.1.3 Phase Locked Loop (PLL) Clock Modules
          1. 6.6.1.3.1 Block Diagram
          2. 6.6.1.3.2 PLL Timing Specifications
        4. 6.6.1.4 External Clock Inputs
      2. 6.6.2 Clock Domains
        1. 6.6.2.1 Clock Domain Descriptions
        2. 6.6.2.2 Mapping of Clock Domains to Device Modules
      3. 6.6.3 Clock Test Mode
    7. 6.7  Clock Monitoring
      1. 6.7.1 Clock Monitor Timings
      2. 6.7.2 External Clock (ECLK) Output Functionality
      3. 6.7.3 Dual Clock Comparators
        1. 6.7.3.1 Features
        2. 6.7.3.2 Mapping of DCC Clock Source Inputs
    8. 6.8  Glitch Filters
    9. 6.9  Device Memory Map
      1. 6.9.1 Memory Map Diagram
      2. 6.9.2 Memory Map Table
      3. 6.9.3 Master/Slave Access Privileges
        1. 6.9.3.1 Special Notes on Accesses to Certain Slaves
      4. 6.9.4 POM Overlay Considerations
    10. 6.10 Flash Memory
      1. 6.10.1 Flash Memory Configuration
      2. 6.10.2 Main Features of Flash Module
      3. 6.10.3 ECC Protection for Flash Accesses
      4. 6.10.4 Flash Access Speeds
      5. 6.10.5 Flash Program and Erase Timings for Program Flash
      6. 6.10.6 Flash Program and Erase Timings for Data Flash
    11. 6.11 Tightly Coupled RAM (TCRAM) Interface Module
      1. 6.11.1 Features
      2. 6.11.2 TCRAM Interface ECC Support
    12. 6.12 Parity Protection for Peripheral RAMs
    13. 6.13 On-Chip SRAM Initialization and Testing
      1. 6.13.1 On-Chip SRAM Self-Test Using PBIST
        1. 6.13.1.1 Features
        2. 6.13.1.2 PBIST RAM Groups
      2. 6.13.2 On-Chip SRAM Auto Initialization
    14. 6.14 External Memory Interface (EMIF)
      1. 6.14.1 Features
      2. 6.14.2 Electrical and Timing Specifications
        1. 6.14.2.1 Asynchronous RAM
        2. 6.14.2.2 Synchronous Timing
    15. 6.15 Vectored Interrupt Manager
      1. 6.15.1 VIM Features
      2. 6.15.2 Interrupt Request Assignments
    16. 6.16 DMA Controller
      1. 6.16.1 DMA Features
      2. 6.16.2 Default DMA Request Map
    17. 6.17 Real Time Interrupt Module
      1. 6.17.1 Features
      2. 6.17.2 Block Diagrams
      3. 6.17.3 Clock Source Options
      4. 6.17.4 Network Time Synchronization Inputs
    18. 6.18 Error Signaling Module
      1. 6.18.1 Features
      2. 6.18.2 ESM Channel Assignments
    19. 6.19 Reset / Abort / Error Sources
    20. 6.20 Digital Windowed Watchdog
    21. 6.21 Debug Subsystem
      1. 6.21.1  Block Diagram
      2. 6.21.2  Debug Components Memory Map
      3. 6.21.3  JTAG Identification Code
      4. 6.21.4  Debug ROM
      5. 6.21.5  JTAG Scan Interface Timings
      6. 6.21.6  Advanced JTAG Security Module
      7. 6.21.7  Embedded Trace Macrocell (ETM-R4)
        1. 6.21.7.1 ETM TRACECLKIN Selection
        2. 6.21.7.2 Timing Specifications
      8. 6.21.8  RAM Trace Port (RTP)
        1. 6.21.8.1 Features
        2. 6.21.8.2 Timing Specifications
      9. 6.21.9  Data Modification Module (DMM)
        1. 6.21.9.1 Features
        2. 6.21.9.2 Timing Specifications
      10. 6.21.10 Boundary Scan Chain
  7. 7Peripheral Information and Electrical Specifications
    1. 7.1  Peripheral Legend
    2. 7.2  Multibuffered 12-Bit Analog-to-Digital Converter
      1. 7.2.1 Features
      2. 7.2.2 Event Trigger Options
        1. 7.2.2.1 Default MIBADC1 Event Trigger Hookup
        2. 7.2.2.2 Alternate MIBADC1 Event Trigger Hookup
        3. 7.2.2.3 Default MIBADC2 Event Trigger Hookup
        4. 7.2.2.4 Alternate MIBADC2 Event Trigger Hookup
      3. 7.2.3 ADC Electrical and Timing Specifications
      4. 7.2.4 Performance (Accuracy) Specifications
        1. 7.2.4.1 MibADC Nonlinearity Errors
        2. 7.2.4.2 MibADC Total Error
    3. 7.3  General-Purpose Input/Output
      1. 7.3.1 Features
    4. 7.4  Enhanced High-End Timer (N2HET)
      1. 7.4.1 Features
      2. 7.4.2 N2HET RAM Organization
      3. 7.4.3 Input Timing Specifications
      4. 7.4.4 N2HET1-N2HET2 Interconnections
      5. 7.4.5 N2HET Checking
        1. 7.4.5.1 Internal Monitoring
        2. 7.4.5.2 Output Monitoring Using Dual Clock Comparator (DCC)
      6. 7.4.6 Disabling N2HET Outputs
      7. 7.4.7 High-End Timer Transfer Unit (HTU)
        1. 7.4.7.1 Features
        2. 7.4.7.2 Trigger Connections
    5. 7.5  FlexRay Interface
      1. 7.5.1 Features
      2. 7.5.2 Electrical and Timing Specifications
      3. 7.5.3 FlexRay Transfer Unit
    6. 7.6  Controller Area Network (DCAN)
      1. 7.6.1 Features
      2. 7.6.2 Electrical and Timing Specifications
    7. 7.7  Local Interconnect Network Interface (LIN)
      1. 7.7.1 LIN Features
    8. 7.8  Serial Communication Interface (SCI)
      1. 7.8.1 Features
    9. 7.9  Inter-Integrated Circuit (I2C)
      1. 7.9.1 Features
      2. 7.9.2 I2C I/O Timing Specifications
    10. 7.10 Multibuffered / Standard Serial Peripheral Interface
      1. 7.10.1 Features
      2. 7.10.2 MibSPI Transmit and Receive RAM Organization
      3. 7.10.3 MibSPI Transmit Trigger Events
        1. 7.10.3.1 MIBSPI1 Event Trigger Hookup
        2. 7.10.3.2 MIBSPI3 Event Trigger Hookup
        3. 7.10.3.3 MIBSPI5 Event Trigger Hookup
      4. 7.10.4 MibSPI/SPI Master Mode I/O Timing Specifications
      5. 7.10.5 SPI Slave Mode I/O Timings
    11. 7.11 Ethernet Media Access Controller
      1. 7.11.1 Ethernet MII Electrical and Timing Specifications
      2. 7.11.2 Ethernet RMII Electrical and Timing Specifications
      3. 7.11.3 Management Data Input/Output (MDIO) Electrical and Timing Specifications
  8. 8Device and Documentation Support
    1. 8.1 Device Support
      1. 8.1.1 Development Support
      2. 8.1.2 Device Nomenclature
    2. 8.2 Documentation Support
      1. 8.2.1 Related Documentation from Texas Instruments
    3. 8.3 Community Resources
    4. 8.4 Trademarks
    5. 8.5 Electrostatic Discharge Caution
    6. 8.6 Glossary
    7. 8.7 Device Identification Code Register
    8. 8.8 Die Identification Registers
    9. 8.9 Module Certifications
      1. 8.9.1 FlexRay™ Certifications
      2. 8.9.2 DCAN Certification
      3. 8.9.3 LIN Certification
        1. 8.9.3.1 LIN Master Mode
        2. 8.9.3.2 LIN Slave Mode - Fixed Baud Rate
        3. 8.9.3.3 LIN Slave Mode - Adaptive Baud Rate
  9. 9Mechanical Packaging and Orderable Information
    1. 9.1 Packaging Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • ZWT|337
  • PGE|144
Thermal pad, mechanical data (Package|Pins)
Orderable Information

3 Device Comparison

lists the features of the devices.

Table 3-1 TMS570LS3137 Device Comparison(2)(3)

FEATURES DEVICES
Generic Part Number TMS570LC4357ZWT(1) TMS570LS3137ZWT(1) TMS570LS3137PGE(1) TMS570LS3135ZWT TMS570LS3135PGE TMS570LS1227ZWT(1)
Package 337 BGA 337 BGA 144 QFP 337 BGA 144 QFP 337 BGA
CPU ARM Cortex-R5F ARM Cortex-R4F ARM Cortex-R4F ARM Cortex-R4F ARM Cortex-R4F ARM Cortex-R4F
Frequency (MHz) 300 180 160 180 160 180
Cache (KB) 32 I
32 D		 – – – – –
Flash (KB) 4096 3072 3072 3072 3072 1280
RAM (KB) 512 256 256 256 256 192
Data Flash [EEPROM] (KB) 128 64 64 64 64 64
EMAC 10/100 10/100 10/100 – – 10/100
FlexRay 2-ch 2-ch 2-ch 2-ch 2-ch 2-ch
CAN 4 3 3 3 3 3
MibADC
12-bit (Ch)		 2 (41ch) 2 (24ch) 2 (24ch) 2 (24ch) 2 (24ch) 2 (24ch)
N2HET (Ch) 2 (64) 2 (44) 2 (40) 2 (50) 2 (50) 2 (44)
ePWM Channels 14 – – – – 14
eCAP Channels 6 – – – – 6
eQEP Channels 2 – – – – 2
MibSPI (CS) 5 (4 x 6 + 2) 3 (6 + 6 + 4) 3 (5 + 6 + 1) 3 (6 + 6 + 4) 3 (5 + 6 + 1) 3 (6 + 6 + 4)
SPI (CS) – 2 (2 + 1) 1 (1) 2 (2 + 1) 1 (1) 2 (2 + 1)
SCI (LIN) 4 (2 with LIN) 2 (1 with LIN) 2 (1 with LIN) 2 (1 with LIN) 2 (1 with LIN) 2 (1 with LIN)
I2C 2 1 1 1 1 1
GPIO (INT)(4) 168 (with 16 interrupt capable) 144 (with 16 interrupt capable) 58 (with 4 interrupt capable) 144 (with 16 interrupt capable) 58 (with 4 interrupt capable) 101 (with 16 interrupt capable)
EMIF 16-bit data 16-bit data – 16-bit data – 16-bit data
ETM (Trace) 32-bit 32-bit – 32-bit – –
RTP/DMM 16/16 16/16 – 16/16 – –
Operating
Temperature		 -40ºC to 125ºC -40ºC to 125ºC -40ºC to 125ºC -40ºC to 125ºC -40ºC to 125ºC -40ºC to 125ºC
Core Supply (V) 1.14 V – 1.32 V 1.14 V – 1.32 V 1.14 V – 1.32 V 1.14 V – 1.32 V 1.14 V – 1.32 V 1.14 V – 1.32 V
I/O Supply (V) 3.0 V – 3.6 V 3.0 V – 3.6 V 3.0 V – 3.6 V 3.0 V – 3.6 V 3.0 V – 3.6 V 3.0 V – 3.6 V
(1) Superset device
(2) For additional device variants, see www.ti.com/tms570
(3) This table reflects the maximum configuration for each peripheral. Some functions are multiplexed and not all pins are available at the same time.
(4) Total number of pins that can be used as general-purpose input or output when not used as part of a peripheral