SCDS406A December   2018  – February 2024 TMUX1109

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics (VDD = 5V ±10 %)
    6. 5.6 Electrical Characteristics (VDD = 3.3V ±10 %)
    7. 5.7 Electrical Characteristics (VDD = 2.5V ±10 %), (VSS = –2.5V ±10 %)
    8. 5.8 Electrical Characteristics (VDD = 1.8V ±10 %)
    9. 5.9 Electrical Characteristics (VDD = 1.2V ±10 %)
    10.     Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
      1. 6.1.1  On-Resistance
      2. 6.1.2  Off-Leakage Current
      3. 6.1.3  On-Leakage Current
      4. 6.1.4  Transition Time
      5. 6.1.5  Break-Before-Make
      6. 6.1.6  tON(EN) and tOFF(EN)
      7. 6.1.7  Charge Injection
      8. 6.1.8  Off Isolation
      9. 6.1.9  Crosstalk
      10. 6.1.10 Bandwidth
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Bidirectional Operation
      2. 6.3.2 Rail to Rail Operation
      3. 6.3.3 1.8V Logic Compatible Inputs
      4. 6.3.4 Fail-Safe Logic
      5. 6.3.5 Ultra-Low Leakage Current
      6. 6.3.6 Ultra-Low Charge Injection
    4. 6.4 Device Functional Modes
      1. 6.4.1 Truth Tables
  8. 7 Application and Implementation
    1. 7.1 Application Information
    2. 7.2 Typical Application
      1. 7.2.1 Design Requirements
      2. 7.2.2 Detailed Design Procedure
      3. 7.2.3 Application Curve
    3. 7.3 Power Supply Recommendations
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
      2. 7.4.2 Layout Example
  9. 8 Device and Documentation Support
    1. 8.1 Documentation Support
      1. 8.1.1 Related Documentation
    2. 8.2 Receiving Notification of Documentation Updates
    3. 8.3 Support Resources
    4. 8.4 Trademarks
    5. 8.5 Electrostatic Discharge Caution
    6. 8.6 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • PW|16
  • RSV|16
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7 Application and Implementation

Note:

Information in the following applications sections is not part of the TI component specification, and TI does not warrant its accuracy or completeness. TI’s customers are responsible for determining suitability of components for their purposes, as well as validating and testing their design implementation to confirm system functionality.