SCDS401C
December 2018 – February 2024
TMUX1119
PRODUCTION DATA
1
1
Features
2
Applications
3
Description
4
Pin Configuration and Functions
5
Specifications
5.1
Absolute Maximum Ratings
5.2
ESD Ratings
5.3
Recommended Operating Conditions
5.4
Thermal Information
5.5
Electrical Characteristics (VDD = 5V ±10 %)
5.6
Electrical Characteristics (VDD = 3.3V ±10 %)
5.7
Electrical Characteristics (VDD = 1.8V ±10 %)
5.8
Electrical Characteristics (VDD = 1.2V ±10 %)
Typical Characteristics
6
Parameter Measurement Information
6.1
On-Resistance
6.2
Off-Leakage Current
6.3
On-Leakage Current
6.4
Transition Time
6.5
Break-Before-Make
6.6
Charge Injection
6.7
Off Isolation
6.8
Crosstalk
6.9
Bandwidth
7
Detailed Description
7.1
Overview
7.2
Functional Block Diagram
7.3
Feature Description
7.3.1
Bidirectional Operation
7.3.2
Rail to Rail Operation
7.3.3
1.8V Logic Compatible Inputs
7.3.4
Fail-Safe Logic
7.3.5
Ultra-Low Leakage Current
7.3.6
Ultra-Low Charge Injection
7.4
Device Functional Modes
7.5
Truth Tables
8
Application and Implementation
8.1
Application Information
8.2
Typical Application
8.2.1
Design Requirements
8.2.2
Detailed Design Procedure
8.2.3
Application Curve
8.3
Power Supply Recommendations
8.4
Layout
8.4.1
Layout Guidelines
8.4.2
Layout Example
9
Device and Documentation Support
9.1
Documentation Support
9.1.1
Related Documentation
9.2
Receiving Notification of Documentation Updates
9.3
Support Resources
9.4
Trademarks
9.5
Electrostatic Discharge Caution
9.6
Glossary
10
Revision History
11
Mechanical, Packaging, and Orderable Information
Package Options
Mechanical Data (Package|Pins)
DCK|6
MPDS114E
DBV|6
MPDS026Q
Thermal pad, mechanical data (Package|Pins)
Orderable Information
scds401c_oa
scds401c_pm
9.6
Glossary
TI Glossary
This glossary lists and explains terms, acronyms, and definitions.