SCDS412B June   2019  – January 2024 TMUX1133 , TMUX1134

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Comparison Table
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Electrical Characteristics (VDD = 5V ±10 %)
    6. 6.6  Electrical Characteristics (VDD = 3.3V ±10 %)
    7. 6.7  Electrical Characteristics (VDD = 2.5V ±10 %), (VSS = –2.5V ±10 %)
    8. 6.8  Electrical Characteristics (VDD = 1.8V ±10 %)
    9. 6.9  Electrical Characteristics (VDD = 1.2V ±10 %)
    10. 6.10 Typical Characteristics
  8. 7 Parameter Measurement Information
    1. 7.1  On-Resistance
    2. 7.2  Off-Leakage Current
    3. 7.3  On-Leakage Current
    4. 7.4  Transition Time
    5. 7.5  Break-Before-Make
    6. 7.6  tON(EN) and tOFF(EN)
    7. 7.7  Charge Injection
    8. 7.8  Off Isolation
    9. 7.9  Crosstalk
    10. 7.10 Bandwidth
  9. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Bidirectional Operation
      2. 8.3.2 Rail to Rail Operation
      3. 8.3.3 1.8V Logic Compatible Inputs
      4. 8.3.4 Fail-Safe Logic
      5. 8.3.5 Ultra-low Leakage Current
      6. 8.3.6 Ultra-Low Charge Injection
    4. 8.4 Device Functional Modes
    5. 8.5 Truth Tables
  10. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curve
    3. 9.3 Power Supply Recommendations
    4. 9.4 Layout
      1. 9.4.1 Layout Guidelines
      2. 9.4.2 Layout Example
  11. 10Device and Documentation Support
    1. 10.1 Documentation Support
      1. 10.1.1 Related Documentation
    2. 10.2 Receiving Notification of Documentation Updates
    3. 10.3 Support Resources
    4. 10.4 Trademarks
    5. 10.5 Electrostatic Discharge Caution
    6. 10.6 Glossary
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5 Pin Configuration and Functions

GUID-297B0249-9249-4B27-A12D-80D917DCF8CF-low.svg Figure 5-1 TMUX1133: PW Package,16-Pin TSSOP(Top View)
Table 5-1 Pin Functions TMUX1133
PIN TYPE(1) DESCRIPTION(2)
NAME NO.
S2B 1 I/O Source pin 2B. Can be an input or output.
S2A 2 I/O Source pin 2A. Can be an input or output.
S3B 3 I/O Source pin 3B. Can be an input or output.
D3 4 I/O Drain pin 3. Can be an input or output.
S3A 5 I/O Source pin 3A. Can be an input or output.
EN 6 I Active low logic enable. When this pin is high, all switches are turned off. When this pin is low, the SELx inputs determine switch connection as listed in Table 8-1.
VSS 7 P Negative power supply. This pin is the most negative power-supply potential. For reliable operation, connect a decoupling capacitor ranging from 0.1µF to 10µF between VSS and GND. VSS must be connected to ground for single supply voltage applications.
GND 8 P Ground (0V) reference
SEL3 9 I Logic control select pin 3. Controls switch 3 connection as listed in Table 8-1.
SEL2 10 I Logic control select pin 2. Controls switch 2connection as listed in Table 8-1.
SEL1 11 I Logic control select pin 1. Controls switch 1 connection as listed in Table 8-1.
S1A 12 I/O Source pin 1A. Can be an input or output.
S1B 13 I/O Source pin 1B. Can be an input or output.
D1 14 I/O Drain pin 1. Can be an input or output.
D2 15 I/O Drain pin 2. Can be an input or output.
VDD 16 P Positive power supply. This pin is the most positive power-supply potential. For reliable operation, connect a decoupling capacitor ranging from 0.1µF to 10µF between VDD and GND.
(1) I = input, O = output, I/O = input and output, P = power
(2) Refer to Section 8.4 for what to do with unused pins
GUID-75CEDDF9-72ED-4B32-B940-7F9475E35212-low.svg Figure 5-2 TMUX1134: PW Package,20-Pin TSSOP(Top View)
Table 5-2 Pin Functions TMUX1134
PIN TYPE(1) DESCRIPTION(2)
NAME NO.
SEL1 1 I Logic control select pin 1. Controls switch 1 connection as listed in Table 8-2.
S1A 2 I/O Source pin 1A. Can be an input or output.
D1 3 I/O Drain pin 1. Can be an input or output.
S1B 4 I/O Source pin 1B. Can be an input or output.
VSS 5 P Negative power supply. This pin is the most negative power-supply potential. For reliable operation, connect a decoupling capacitor ranging from 0.1µF to 10µF between VSS and GND. VSS must be connected to ground for single supply voltage applications.
GND 6 P .Ground (0V) reference.
S2B 7 I/O Source pin 2B. Can be an input or output.
D2 8 I/O Drain pin 2. Can be an input or output.
S2A 9 I/O Source pin 2A. Can be an input or output.
SEL2 10 I Logic control select pin 2. Controls switch 2 connection as listed in Table 8-2.
SEL3 11 I Logic control select pin 3. Controls switch 3 connection as listed in Table 8-2.
S3A 12 I/O Source pin 3A. Can be an input or output.
D3 13 I/O Drain pin 3. Can be an input or output.
S3B 14 I/O Source pin 3B. Can be an input or output.
N.C. 15 Not Connected Not Connected. Can be shorted to GND or left floating.
VDD 16 P Positive power supply. This pin is the most positive power-supply potential. For reliable operation, connect a decoupling capacitor ranging from 0.1µF to 10µF between VDD and GND.
S4B 17 I/O Source pin 4B. Can be an input or output.
D4 18 I/O Drain pin 4. Can be an input or output.
S4A 19 I/O Source pin 4A. Can be an input or output.
SEL4 20 I Logic control select pin 4. Controls switch 4 connection as listed in Table 8-2.
(1) I = input, O = output, I/O = input and output, P = power
(2) Refer to Section 8.4 for what to do with unused pins