SCDS402B June   2019  – February 2024 TMUX1136

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics (VDD = 5V ±10 %)
    6. 5.6 Electrical Characteristics (VDD = 3.3V ±10 %)
    7. 5.7 Electrical Characteristics (VDD = 1.8V ±10 %)
    8. 5.8 Electrical Characteristics (VDD = 1.2V ±10 %)
    9.     Typical Characteristics
  7. 6 Parameter Measurement Information
    1. 6.1 On-Resistance
    2. 6.2 Off-Leakage Current
    3. 6.3 On-Leakage Current
    4. 6.4 Transition Time
    5. 6.5 Break-Before-Make
    6. 6.6 Charge Injection
    7. 6.7 Off Isolation
    8. 6.8 Crosstalk
    9. 6.9 Bandwidth
  8. 7 Detailed Description
    1. 7.1 Functional Block Diagram
    2. 7.2 Feature Description
      1. 7.2.1 Bidirectional Operation
      2. 7.2.2 Rail to Rail Operation
      3. 7.2.3 1.8V Logic Compatible Inputs
      4. 7.2.4 Fail-Safe Logic
      5. 7.2.5 Ultra-low Leakage Current
      6. 7.2.6 Ultra-low Charge Injection
    3. 7.3 Device Functional Modes
      1. 7.3.1 Truth Tables
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curve
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Documentation Support
      1. 9.1.1 Related Documentation
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • DGS|10
  • DQA|10
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Abstract

at TA = 25°C, VDD = 5V (unless otherwise noted)

GUID-13A0635D-4521-46C8-88F3-AF3D973623DF-low.gif
TA = 25°C
Figure 5-1 On-Resistance vs Source or Drain Voltage
GUID-26227789-FB77-4167-A868-8991A659E29A-low.gif
VDD = 3.3V
Figure 5-3 On-Resistance vs Temperature
GUID-0BCCDABE-12C3-4756-98F3-4A5D2781857F-low.gif
TA = 25°C
Figure 5-5 On-Leakage vs Source or Drain Voltage
GUID-68C65FE5-1943-48C1-A8C7-A581C9BB1AE3-low.gif
VDD = 3.3V
Figure 5-7 Leakage Current vs Temperature
GUID-6751FFF1-B3E2-4E65-B5CC-CD23C2D40489-low.gif
VSEL = VDD V
Figure 5-9 Supply Current vs Temperature
GUID-FCA1C941-0365-479D-89B8-0B28553A7B6A-low.gif
TA = -40°C to 125°C
Figure 5-11 Charge Injection vs Drain Voltage
GUID-8A701A16-E44C-45A4-8399-A2EA1C4CEF23-low.gif
TA = 25°C
Figure 5-13 Output TTRANSITION vs Supply Voltage
GUID-71384E7D-E967-46E9-A4BC-4AE9A96E3EAA-low.gif
TA = -40°C to 125°C
Figure 5-15 On Response vs Frequency
GUID-7E0B3A6C-3468-4422-9D1F-6BA2E08B694B-low.gif
VDD = 5V
Figure 5-2 On-Resistance vs Temperature
GUID-1EF99EC9-DCCA-48A6-AA3B-84F948F9C2F5-low.gif
TA = 25°C
Figure 5-4 On-Resistance vs Source or Drain Voltage
GUID-B2D490FD-C538-4846-B7D6-33B11E597601-low.gif
VDD = 5V
Figure 5-6 On-Leakage vs Source or Drain Voltage
GUID-04A9DF02-96F3-4DEF-885D-D672C56AC7CF-low.gif
VDD = 5V
Figure 5-8 Leakage Current vs Temperature
GUID-E8FA4C5B-1162-4411-A5E7-9C87AFF71CA6-low.gif
TA = 25°C
Figure 5-10 Supply Current vs Logic Voltage
GUID-07EAD574-961D-4E42-99C1-A2481F08E575-low.gif
TA = -40°C to 125°C
Figure 5-12 Charge Injection vs Drain Voltage
GUID-FB724BA7-C834-48F6-A1F5-6FB45CAD5BD2-low.gif
TA = -40°C to 125°C
Figure 5-14 Xtalk and Off-Isolation vs Frequency