SCDS402B June   2019  – February 2024 TMUX1136

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics (VDD = 5V ±10 %)
    6. 5.6 Electrical Characteristics (VDD = 3.3V ±10 %)
    7. 5.7 Electrical Characteristics (VDD = 1.8V ±10 %)
    8. 5.8 Electrical Characteristics (VDD = 1.2V ±10 %)
    9.     Typical Characteristics
  7. 6 Parameter Measurement Information
    1. 6.1 On-Resistance
    2. 6.2 Off-Leakage Current
    3. 6.3 On-Leakage Current
    4. 6.4 Transition Time
    5. 6.5 Break-Before-Make
    6. 6.6 Charge Injection
    7. 6.7 Off Isolation
    8. 6.8 Crosstalk
    9. 6.9 Bandwidth
  8. 7 Detailed Description
    1. 7.1 Functional Block Diagram
    2. 7.2 Feature Description
      1. 7.2.1 Bidirectional Operation
      2. 7.2.2 Rail to Rail Operation
      3. 7.2.3 1.8V Logic Compatible Inputs
      4. 7.2.4 Fail-Safe Logic
      5. 7.2.5 Ultra-low Leakage Current
      6. 7.2.6 Ultra-low Charge Injection
    3. 7.3 Device Functional Modes
      1. 7.3.1 Truth Tables
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curve
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Documentation Support
      1. 9.1.1 Related Documentation
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • DGS|10
  • DQA|10
Thermal pad, mechanical data (Package|Pins)
Orderable Information

8.3 Power Supply Recommendations

The TMUX1136 operates across a wide supply range of 1.08V to 5.5V. Do not exceed the absolute maximum ratings because stresses beyond the listed ratings can cause permanent damage to the devices.

Power-supply bypassing improves noise margin and prevents switching noise propagation from the VDD supply to other components. Good power-supply decoupling is important to achieve optimum performance. For improved supply noise immunity, use a supply decoupling capacitor ranging from 0.1 μF to 10 μF from VDD to ground. Place the bypass capacitors as close to the power supply pins of the device as possible using low-impedance connections. TI recommends using multi-layer ceramic chip capacitors (MLCCs) that offer low equivalent series resistance (ESR) and inductance (ESL) characteristics for power-supply decoupling purposes. For very sensitive systems, or for systems in harsh noise environments, avoiding the use of vias for connecting the capacitors to the device pins may offer superior noise immunity. The use of multiple vias in parallel lowers the overall inductance and is beneficial for connections to ground planes.