SCDS426E March   2020  – October 2022 TMUX1308 , TMUX1309

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Device Comparison Table
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3  Recommended Operating Conditions
    4. 7.4  Thermal Information: TMUX1308
    5. 7.5  Thermal Information: TMUX1309
    6. 7.6  Electrical Characteristics
    7. 7.7  Logic and Dynamic Characteristics
    8. 7.8  Timing Characteristics
    9. 7.9  Injection Current Coupling
    10. 7.10 Typical Characteristics
  8. 8 Parameter Measurement Information
    1. 8.1  On-Resistance
    2. 8.2  Off-Leakage Current
    3. 8.3  On-Leakage Current
    4. 8.4  Transition Time
    5. 8.5  Break-Before-Make
    6. 8.6  tON(EN) and tOFF(EN)
    7. 8.7  Charge Injection
    8. 8.8  Off Isolation
    9. 8.9  Crosstalk
    10. 8.10 Bandwidth
    11. 8.11 Injection Current Control
  9. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1 Bidirectional Operation
      2. 9.3.2 Rail-to-Rail Operation
      3. 9.3.3 1.8 V Logic Compatible Inputs
      4. 9.3.4 Fail-Safe Logic
      5. 9.3.5 Injection Current Control
        1. 9.3.5.1 TMUX13xx is Powered, Channel is Unselected, and the Input Signal is Greater Than VDD (VDD = 5 V, VINPUT = 5.5 V)
        2. 9.3.5.2 TMUX13xx is Powered, Channel is Selected, and the Input Signal is Greater Than VDD (VDD = 5 V, VINPUT = 5.5 V)
        3. 9.3.5.3 TMUX13xx is Unpowered and the Input Signal has a Voltage Present (VDD = 0 V, VINPUT = 3 V)
    4. 9.4 Device Functional Modes
    5. 9.5 Truth Tables
  10. 10Application and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Application
    3. 10.3 Design Requirements
    4. 10.4 Detailed Design Procedure
  11. 11Power Supply Recommendations
  12. 12Layout
    1. 12.1 Layout Guidelines
    2. 12.2 Layout Example
  13. 13Device and Documentation Support
    1. 13.1 Documentation Support
      1. 13.1.1 Related Documentation
    2. 13.2 Receiving Notification of Documentation Updates
    3. 13.3 Support Resources
    4. 13.4 Trademarks
    5. 13.5 Electrostatic Discharge Caution
    6. 13.6 Glossary
  14. 14Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7.7 Logic and Dynamic Characteristics

At specified VDD ±10%
Typical values measured at nominal VDD and TA = 25°C.
PARAMETER TEST CONDITIONS VDD Operating free-air temperature (TA) UNIT
–40°C to 125°C
MIN TYP MAX
LOGIC INPUTS (EN, A0, A1, A2)
VIH Input logic high 1.8 V 0.95 5.5 V
2.5 V 1.1 5.5
3.3 V 1.15 5.5
5 V 1.25 5.5
VIL Input logic low 1.8 V 0 0.6 V
2.5 V 0 0.7
3.3 V 0 0.8
5 V 0 0.95
IIH Logic high input leakage current VLOGIC = 1.8 V or VDD All 1 uA
IIL Logic low input leakage current VLOGIC = 0 V All –1 uA
CIN Logic input capacitance VLOGIC = 0 V, 1.8 V, VDD
f = 1 MHz		 All 1 2 pF
DYNAMIC CHARACTERISTICS
QINJ Charge Injection VS = VDD / 2
RS = 0 Ω, CL = 100 pF		 1.8 V –0.5 pC
2.5 V –0.5
3.3 V –1
5 V –6.5
OISO Off Isolation VBIAS = VDD / 2
VS = 200 mVpp
RL = 50 Ω, CL = 5 pF
f = 100 kHz		 1.8 V –110 dB
2.5 V –110
3.3 V –110
5 V –110
OISO Off Isolation VBIAS = VDD / 2
VS = 200 mVpp
RL = 50 Ω, CL = 5 pF
f = 1 MHz		 1.8 V –90 dB
2.5 V –90
3.3 V –90
5 V –90
XTALK Crosstalk VBIAS = VDD / 2
VS = 200 mVpp
RL = 50 Ω, CL = 5 pF
f = 100 kHz		 1.8 V –110 dB
2.5 V –110
3.3 V –110
5 V –110
XTALK Crosstalk VBIAS = VDD / 2
VS = 200 mVpp
RL = 50 Ω, CL = 5 pF
f = 1 MHz		 1.8 V –90 dB
2.5 V –90
3.3 V –90
5 V –90
BW Bandwidth VBIAS = VDD / 2
VS = 200 mVpp
RL = 50 Ω, CL = 5 pF		 1.8 V 350 MHz
2.5 V 450
3.3 V 500
5 V 500