SCDS472 august   2023 TMUX131

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Revision History
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Dynamic Characteristics
    7. 6.7 Typical Characteristics
  8.   Parameter Measurement Information
  9. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 IOFF Protection
      2. 7.3.2 1.8-V Compatible Logic
      3. 7.3.3 Overvoltage Tolerant (OVT)
      4. 7.3.4 Integrated Pull-Down Resistors
    4. 7.4 Device Functional Modes
  10. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Signal Expansion (I3C and I2C)
      2. 8.2.2 Design Requirements
      3. 8.2.3 Detailed Design Procedure
      4. 8.2.4 Application Curves
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  11. 9 Device and Documentation Support
    1. 9.1 Documentation Support
      1. 9.1.1 Related Documentation
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  12. 10Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.6 Dynamic Characteristics

TA = –40°C to 85°C, Typical values are at VDD = 3.3 V, TA = 25°C (unless otherwise noted)
PARAMETERTEST CONDITIONSMINTYPMAXUNIT
tpdPropagation delayRL = 50 Ω, CL = 5 pF, VDD = 2.5 V to 4.3 V,
VS = 0.4 V or 3.3 V		50ps
tTRANSwitching time from control inputRL = 50 Ω, CL = 5 pF, VDD = 2.5 V to 4.3 V,
VS = 0.4 V or 3.3 V		400ns
tONSwitch turnon time (from disabled to active mode)RL = 50 Ω, CL = 5 pF, VDD = 2.5 V to 4.3 V,
VS = 0.4 V or 3.3 V		100µs
tOFFSwitch turnoff time (from active to disabled mode)RL = 50 Ω, CL = 5 pF, VDD = 2.5 V to 4.3 V,
VS = 0.4 V or 3.3 V		100µs
CS(ON)
CD(ON)		ON capacitanceVDD = 3.3 V, VS = 0 V or 3.3 V, f = 240 MHz, Switch ON1.3pF
CS(OFF)OFF capacitanceVDD = 3.3 V, VS = 0 V or 3.3 V, f = 240 MHz, Switch OFF1pF
CIDigital input capacitanceVDD = 3.3 V, VI = 0 V or 2 V2.2pF
OISO Differential OFF isolationVS = –10 dBm, VDC_BIAS = 2.4 V, RT = 50 Ω, f = 240 MHz (see Figure 7-3), Switch OFF–38dB
XTALKChannel-to-Channel Crosstalk VS = –10 dBm, VDC_BIAS = 0.2 V, RT = 50 Ω, f = 240 MHz (see Figure 7-4), Switch ON–38dB
BW–3-dB bandwidthVDD = 2.5 V to 4.3 V, RL = 50 Ω (see Figure 7-5), Switch ON6.5GHz
SUPPLY
VDDPower supply voltage2.54.3V
IDDPositive supply currentVDD = 4.3 V, VIN = VDD or GND, VS = 0 V,
Switch ON or OFF		2840µA