SCDS472 august   2023 TMUX131

PRODUCTION DATA  

  1.   1
  2. Features
  3. Applications
  4. Description
  5. Revision History
  6. Pin Configuration and Functions
  7. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Dynamic Characteristics
    7. 6.7 Typical Characteristics
  8.   Parameter Measurement Information
  9. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 IOFF Protection
      2. 7.3.2 1.8-V Compatible Logic
      3. 7.3.3 Overvoltage Tolerant (OVT)
      4. 7.3.4 Integrated Pull-Down Resistors
    4. 7.4 Device Functional Modes
  10. Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Signal Expansion (I3C and I2C)
      2. 8.2.2 Design Requirements
      3. 8.2.3 Detailed Design Procedure
      4. 8.2.4 Application Curves
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  11. Device and Documentation Support
    1. 9.1 Documentation Support
      1. 9.1.1 Related Documentation
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  12. 10Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Features

  • Compatible with high-speed I3C signals
  • VDD range: 2.5 V to 4.3 V
  • High performance switch characteristics:
    • Bandwidth (–3 dB): 6.5 GHz
    • RON (typical): 5.5 Ω
    • CON (typical): 1.3 pF
  • Current consumption: 28 µA (typical)
  • Integrated pull down resistor on logic pins
  • Special features:
    • IOFF protection prevents current leakage in powered-down state (VDD = 0 V)
    • 1.8-V compatible control inputs (SEL)
    • Overvoltage tolerance (OVT) on all I/O pins up to 5.5 V without external components
  • ESD performance:
    • 2-kV Human-Body Model (A114B, Class II)
    • 1-kV Charged-Device Model (C101)
  • Package:
    • 12-Pin VQFN package (1.8-mm × 1.8-mm,
      0.5-mm pitch)