SCDS472 august   2023 TMUX131

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Revision History
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Dynamic Characteristics
    7. 6.7 Typical Characteristics
  8.   Parameter Measurement Information
  9. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 IOFF Protection
      2. 7.3.2 1.8-V Compatible Logic
      3. 7.3.3 Overvoltage Tolerant (OVT)
      4. 7.3.4 Integrated Pull-Down Resistors
    4. 7.4 Device Functional Modes
  10. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Signal Expansion (I3C and I2C)
      2. 8.2.2 Design Requirements
      3. 8.2.3 Detailed Design Procedure
      4. 8.2.4 Application Curves
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  11. 9 Device and Documentation Support
    1. 9.1 Documentation Support
      1. 9.1.1 Related Documentation
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  12. 10Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.5 Electrical Characteristics

TA = –40°C to 85°C, typical values are at VDD = 3.3 V and TA = 25°C (unless otherwise noted)
PARAMETERTEST CONDITIONSMINTYPMAXUNIT
RONON-state resistanceVDD = 2.5 V, VS = 1.5V, ION = –8 mA (see Figure 7-1)5.57Ω
ΔRONON-state resistance match
between channels		VDD = 2.5 V, VS = 1.5 V, ION = –8 mA0.1Ω
RON (FLAT) ON-state resistance flatness VDD = 2.5 V, VS = 1.5 V to 3.3 V, ION = –8 mA1Ω
IOZOFF leakage currentVDD = 4.3 V, Switch OFF, VS = 1.5 V to 3.3 V, VD= 0 V (see Figure 7-2)–22µA
IOFFPower-off leakage currentVDD = 0 V, Power off, VS = 1.5 V to 3.3 V, VD= NC–1010µA
IONON leakage currentVDD = 4.3 V, Switch ON, VS = 1.5 V to 3.3 V, VD= NC–22µA
DIGITAL CONTROL INPUTS (SEL)
VIHInput logic highVDD = 2.5 V to 4.3 V1.3V
VILInput logic lowVDD = 2.5 V to 4.3 V0.6V
IINInput leakage currentVDD = 4.3 V, VS/D = 0 V to 3.6 V, VSEL = 0 V to 4.3 V–1010µA