SCDS391C October   2018  – December 2019 TMUX1574

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Device Images
      1.      Application Example
      2.      Block Diagram
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Dynamic Characteristics
    7. 6.7 Timing Requirements
    8. 6.8 Typical Characteristics
      1. 6.8.1 Eye Diagrams
  7. 7 Parameter Measurement Information
    1. 7.1  On-Resistance
    2. 7.2  Off-Leakage Current
    3. 7.3  On-Leakage Current
    4. 7.4  IPOFF Leakage Current
    5. 7.5  Transition Time
    6. 7.6  tON (EN) and tOFF (EN) Time
    7. 7.7  tON (VDD) and tOFF (VDD) Time
    8. 7.8  Break-Before-Make Delay
    9. 7.9  Propagation Delay
    10. 7.10 Skew
    11. 7.11 Charge Injection
    12. 7.12 Capacitance
    13. 7.13 Off Isolation
    14. 7.14 Channel-to-Channel Crosstalk
    15. 7.15 Bandwidth
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Bidirectional Operation
      2. 8.3.2 Beyond Supply Operation
      3. 8.3.3 1.8 V Logic Compatible Inputs
      4. 8.3.4 Powered-off Protection
      5. 8.3.5 Fail-Safe Logic
      6. 8.3.6 Low Capacitance
      7. 8.3.7 Integrated Pull-Down Resistors
    4. 8.4 Device Functional Modes
    5. 8.5 Truth Tables
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 Receiving Notification of Documentation Updates
    3. 12.3 Community Resources
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.7 Timing Requirements

VDD = 1.5 V to 5.5 V, GND = 0V, TA = –40°C to +125°C
Typical values are at VDD = 3.3 V, TA = 25°C, (unless otherwise noted).
PARAMETER TEST CONDITIONS MIN NOM MAX UNIT
tTRAN Transition time from control input  VDD = 2.5 V to 5.5 V
VS = VDD
RL = 200 Ω, CL = 15pF
Refer to Transition Timing Figure 		160 350 ns
tTRAN Transition time from control input  VDD < 2.5 V
VS = VDD
RL = 200 Ω, CL = 15pF
Refer to Transition Timing Figure 		180 580 ns
tON(EN) Device turn on time from enable pin VS = VDD
RL = 200 Ω, CL = 15pF
Refer to Ton(EN) & Toff(EN) Figure 		12 35 µs
tOFF(EN) Device turn off time from enable pin VS = VDD
RL = 200 Ω, CL = 15pF
Refer to Ton(EN) & Toff(EN) Figure 		50 95 ns
tON(VDD) Device turn on time (VDD to output) VS = 3.6 V
VDD rise time = 1us
RL = 200 Ω, CL = 15pF
Refer to Ton(vdd) & Toff(vdd) Figure 		20 60 µs
tOFF(VDD) Device turn off time (VDD to output) VS = 3.6 V
VDD fall time = 1us
RL = 200 Ω, CL = 15pF
Refer to Ton(vdd) & Toff(vdd) Figure 		1.2 2.7 µs
tOPEN (BBM) Break before make time VS = 1 V
RL = 200 Ω, CL = 15pF
Refer to Topen(BBM) Figure 		0.5 ns
tSK(P) Inter - channel skew - QFN (RSV) Refer to Tsk Figure 5 ps
tSK(P) Inter - channel skew - DYY (SOT-23) Refer to Tsk Figure 9 ps
tSK(P) Inter - channel skew - TSSOP (PW) Refer to Tsk Figure 18 ps
tPD Propagation delay - QFN (RSV) Refer to Tpd Figure 50 ps
tPD Propagation delay - DYY (SOT-23) Refer to Tpd Figure 75 ps
tPD Propagation delay - TSSOP (PW) Refer to Tpd Figure 95 ps