SCDS464B June   2023  – July 2024 TMUX2889

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Thermal Information
    4. 5.4 Recommended Operating Conditions
    5. 5.5 Source or Drain Continuous Current
    6. 5.6 Electrical Characteristics
    7. 5.7 Switching Characteristics
    8. 5.8 Typical Characteristics
  7. 6 Parameter Measurement Information
    1. 6.1  On-Resistance
    2. 6.2  On-Leakage Current
    3. 6.3  Off-Leakage Current
    4. 6.4  Power-Off Leakage Current
    5. 6.5  tON (VDD) and tOFF (VDD) Time
    6. 6.6  Transition Time
    7. 6.7  Break-Before-Make
    8. 6.8  Propagation Delay
    9. 6.9  THD + Noise
    10. 6.10 Power Supply Rejection Ratio (PSRR)
    11. 6.11 Charge Injection
    12. 6.12 Bandwidth
    13. 6.13 Off Isolation
    14. 6.14 Crosstalk
  8. 7 Detailed Description
    1. 7.1 Functional Block Diagram
    2. 7.2 Truth Table
    3. 7.3 Feature Description
      1. 7.3.1 Beyond the Supply
      2. 7.3.2 Bidirectional Operation
      3. 7.3.3 Over Temperature Protection
      4. 7.3.4 Power-off Protection
      5. 7.3.5 1.8 V Logic Compatible Inputs
      6. 7.3.6 Fail-Safe Logic
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Applications
      1. 8.2.1 Audio Input or Output Switching
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
        3. 8.2.1.3 Application Curve
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Receiving Notification of Documentation Updates
    2. 9.2 Support Resources
    3. 9.3 Trademarks
    4. 9.4 Electrostatic Discharge Caution
    5. 9.5 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information
    1. 11.1 Mechanical Data

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • YBH|9
Thermal pad, mechanical data (Package|Pins)
Orderable Information

8 Application and Implementation

Note:

Information in the following applications sections is not part of the TI component specification, and TI does not warrant its accuracy or completeness. TI’s customers are responsible for determining suitability of components for their purposes, as well as validating and testing their design implementation to confirm system functionality.