SCDS445D May   2022  – July 2024 TMUX4051 , TMUX4052 , TMUX4053

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Comparison Table
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Thermal Information: TMUX405x
    4. 6.4 Recommended Operating Conditions
    5. 6.5 Electrical Characteristics
    6. 6.6 AC Performance Characteristics
    7. 6.7 Timing Characteristics
    8. 6.8 Typical Characteristics
  8. 7 Parameter Measurement Information
    1. 7.1  On-Resistance
    2. 7.2  Off-Leakage Current
    3. 7.3  On-Leakage Current
    4. 7.4  Transition Time
    5. 7.5  Break-Before-Make
    6. 7.6  tON(EN) and tOFF(EN)
    7. 7.7  Propagation Delay
    8. 7.8  Charge Injection
    9. 7.9  Off Isolation
    10. 7.10 Crosstalk
    11. 7.11 Bandwidth
  9. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Bidirectional Operation
      2. 8.3.2 Rail-to-Rail Operation
      3. 8.3.3 1.8V Logic Compatible Inputs
      4. 8.3.4 Device Functional Modes
      5. 8.3.5 Truth Tables
  10. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
    3. 9.3 Design Requirements
    4. 9.4 Detailed Design Procedure
    5. 9.5 Application Curves
    6. 9.6 Power Supply Recommendations
    7. 9.7 Layout
      1. 9.7.1 Layout Guidelines
      2. 9.7.2 Layout Example
  11. 10Device and Documentation Support
    1. 10.1 Documentation Support
      1. 10.1.1 Related Documentation
    2. 10.2 Receiving Notification of Documentation Updates
    3. 10.3 Support Resources
    4. 10.4 Trademarks
    5. 10.5 Electrostatic Discharge Caution
    6. 10.6 Glossary
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)

9.7.1 Layout Guidelines

Route high-speed signals using minimal vias and corners, which reduces signal reflections and impedance changes. When a via must be used, increase the clearance size around it to minimize its capacitance. Each via introduces discontinuities in the signal’s transmission line and increases the chance of picking up interference from the other layers of the board. Be careful when designing test points, through-hole pins are not recommended at high frequencies.

Figure 9-3 shows an example of a PCB layout with the TMUX4051, TMUX4052, and TMUX4053. Some key considerations are as follows:

  • Decouple the VDD and VSS pins with a 0.1µF capacitor, placed as close to the pin as possible. Ensure that the capacitor voltage rating is sufficient.
  • Keep the input lines as short as possible.
  • Use a solid ground plane to help reduce electromagnetic interference (EMI) noise pickup.
  • Do not run sensitive analog traces in parallel with digital traces. Avoid crossing digital and analog traces if possible, and only make perpendicular crossings when necessary.