SCDS445E May   2022  – September 2024 TMUX4051 , TMUX4052 , TMUX4053

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Comparison Table
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Thermal Information: TMUX405x
    4. 6.4 Recommended Operating Conditions
    5. 6.5 Electrical Characteristics
    6. 6.6 AC Performance Characteristics
    7. 6.7 Timing Characteristics
    8. 6.8 Typical Characteristics
  8. 7 Parameter Measurement Information
    1. 7.1  On-Resistance
    2. 7.2  Off-Leakage Current
    3. 7.3  On-Leakage Current
    4. 7.4  Transition Time
    5. 7.5  Break-Before-Make
    6. 7.6  tON(EN) and tOFF(EN)
    7. 7.7  Propagation Delay
    8. 7.8  Charge Injection
    9. 7.9  Off Isolation
    10. 7.10 Crosstalk
    11. 7.11 Bandwidth
  9. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Bidirectional Operation
      2. 8.3.2 Rail-to-Rail Operation
      3. 8.3.3 1.8V Logic Compatible Inputs
      4. 8.3.4 Device Functional Modes
      5. 8.3.5 Truth Tables
  10. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
    3. 9.3 Design Requirements
    4. 9.4 Detailed Design Procedure
    5. 9.5 Application Curves
    6. 9.6 Power Supply Recommendations
    7. 9.7 Layout
      1. 9.7.1 Layout Guidelines
      2. 9.7.2 Layout Example
  11. 10Device and Documentation Support
    1. 10.1 Documentation Support
      1. 10.1.1 Related Documentation
    2. 10.2 Receiving Notification of Documentation Updates
    3. 10.3 Support Resources
    4. 10.4 Trademarks
    5. 10.5 Electrostatic Discharge Caution
    6. 10.6 Glossary
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.6 AC Performance Characteristics

Typical at TA = 25℃ (unless otherwise noted)
PARAMETER TEST CONDITIONS TA = –55℃ to 125℃ UNIT
CONDITION VDD VSS GPN MIN TYP MAX
CAPACITANCE
CS(OFF) VS = (VDD + VSS) / 2V
f = 1MHz		 5V –5V All 3 pF
24V 0V 3
CD(OFF) VS = (VDD + VSS) / 2V
f = 1MHz		 5V –5V TMUX4051 11 pF
24V 0V 9
5V –5V TMUX4052 6
24V 0V 5
5V –5V TMUX4053 4
24V 0V 3
CS(ON)
CD(ON)		 VS = (VDD + VSS) / 2V
f = 1MHz		 5V –5V TMUX4051 13 pF
24V 0V 11
5V –5V TMUX4052 8
24V 0V 7
5V –5V TMUX4053 10
24V 0V 5
DYNAMIC CHARACTERISTICS
Bandwidth (BW)
(Sine Wave Input)		 VBIAS = (VDD + VSS) / 2 (1)
VS = 200mVpp
RL = 50Ω, CL = 5pF		 +5V –5V TMUX4051 280 MHz
24V 0V 430
+5V –5V TMUX4052 600
24V 0V 700
+5V –5V TMUX4053 750
24V 0V 850
Off Isolation
Channel OFF
(Sine Wave Input)		 VBIAS = (VDD + VSS) / 2 (1)
VS = 200mVpp
RL = 50Ω, CL = 5pF
f = 1MHz		 +5V –5V All –95 dB
24V 0V –95
Crosstalk
(Sine Wave Input)		 VBIAS = (VDD + VSS) / 2 (1)
VS = 200mVpp
RL = 50Ω, CL = 5pF
f = 1MHz		 +5V –5V All –90 dB
24V 0V –90
Charge Injection VS = (VDD + VSS) / 2
RS = 0Ω, CL = 100pF		 +5V –5V TMUX4051 6 pC
24V 0V 2
(1) Peak-to-Peak voltage symmetrical about (VDD + VSS) / 2.