SCDS383E August   2018  – December 2019 TMUX6111 , TMUX6112 , TMUX6113

PRODUCTION DATA.  

  1. Features
  2. Applications
  3. Description
    1.     Device Images
      1.      Simplified Schematic
  4. Revision History
  5. Device Comparison Table
  6. Pin Configuration and Functions
    1.     Pin Functions
  7. Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Thermal Information
    4. 7.4 Recommended Operating Conditions
    5. 7.5 Electrical Characteristics (Dual Supplies: ±15 V)
    6. 7.6 Switching Characteristics (Dual Supplies: ±15 V)
    7. 7.7 Electrical Characteristics (Single Supply: 12 V)
    8. 7.8 Switching Characteristics (Single Supply: 12 V)
    9. 7.9 Typical Characteristics
  8. Parameter Measurement Information
    1. 8.1 Truth Tables
  9. Detailed Description
    1. 9.1 Overview
      1. 9.1.1  On-Resistance
      2. 9.1.2  Off-Leakage Current
      3. 9.1.3  On-Leakage Current
      4. 9.1.4  Break-Before-Make Delay
      5. 9.1.5  Turn-On and Turn-Off Time
      6. 9.1.6  Charge Injection
      7. 9.1.7  Off Isolation
      8. 9.1.8  Channel-to-Channel Crosstalk
      9. 9.1.9  Bandwidth
      10. 9.1.10 THD + Noise
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1 Ultra-low Leakage Current
      2. 9.3.2 Ultra-low Charge Injection
      3. 9.3.3 Bidirectional and Rail-to-Rail Operation
    4. 9.4 Device Functional Modes
  10. 10Application and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Application
      1. 10.2.1 Design Requirements
      2. 10.2.2 Detailed Design Procedure
    3. 10.3 Application Curves
  11. 11Power Supply Recommendations
  12. 12Layout
    1. 12.1 Layout Guidelines
    2. 12.2 Layout Example
  13. 13Device and Documentation Support
    1. 13.1 Documentation Support
      1. 13.1.1 Related Documentation
    2. 13.2 Related Links
    3. 13.3 Receiving Notification of Documentation Updates
    4. 13.4 Support Resources
    5. 13.5 Trademarks
    6. 13.6 Electrostatic Discharge Caution
    7. 13.7 Glossary
  14. 14Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Application and Implementation

NOTE

Information in the following applications sections is not part of the TI component specification, and TI does not warrant its accuracy or completeness. TI’s customers are responsible for determining suitability of components for their purposes. Customers should validate and test their design implementation to confirm system functionality.