SCDS397A November   2018  – October 2022 TMUX6136

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Thermal Information
    4. 6.4 Recommended Operating Conditions
    5. 6.5 Electrical Characteristics (Dual Supplies: ±15 V)
    6. 6.6 Switching Characteristics (Dual Supplies: ±15 V)
    7. 6.7 Electrical Characteristics (Single Supply: 12 V)
    8. 6.8 Switching Characteristics (Single Supply: 12 V)
    9.     Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
      1. 7.1.1  On-Resistance
      2. 7.1.2  Off-Leakage Current
      3. 7.1.3  On-Leakage Current
      4. 7.1.4  Transition Time
      5. 7.1.5  Break-Before-Make Delay
      6. 7.1.6  Charge Injection
      7. 7.1.7  Off Isolation
      8. 7.1.8  Channel-to-Channel Crosstalk
      9. 7.1.9  Bandwidth
      10. 7.1.10 THD + Noise
      11. 7.1.11 AC Power Supply Rejection Ratio (AC PSRR)
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Ultralow Leakage Current
      2. 7.3.2 Ultralow Charge Injection
      3. 7.3.3 Bidirectional and Rail-to-Rail Operation
    4. 7.4 Device Functional Modes
      1. 7.4.1 Truth Table
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curve
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 Receiving Notification of Documentation Updates
    3. 11.3 Support Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.3 Thermal Information

THERMAL METRIC(1) TMUX6136 UNIT
PW (TSSOP)
16 PINS
RθJA Junction-to-ambient thermal resistance 111.0 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 41.7 °C/W
RθJB Junction-to-board thermal resistance 57.2 °C/W
ΨJT Junction-to-top characterization parameter 4.1 °C/W
ΨJB Junction-to-board characterization parameter 56.6 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance N/A °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.