SCDS437C January   2021  – December 2024 TMUX6219-Q1

PRODUCTION DATA  

  1.   1
  2. Features
  3. Applications
  4. Description
  5. Pin Configuration and Functions
  6. Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Thermal Information
    4. 5.4  Recommended Operating Conditions
    5. 5.5  Source or Drain Continuous Current
    6. 5.6  ±15 V Dual Supply: Electrical Characteristics 
    7. 5.7  ±15 V Dual Supply: Switching Characteristics 
    8. 5.8  36 V Single Supply: Electrical Characteristics 
    9. 5.9  36 V Single Supply: Switching Characteristics 
    10. 5.10 12 V Single Supply: Electrical Characteristics 
    11. 5.11 12 V Single Supply: Switching Characteristics 
    12. 5.12 +5 V / -8 V Dual Supply: Electrical Characteristics 
    13. 5.13 +5 V / -8 V Dual Supply: Switching Characteristics 
    14. 5.14 ±5 V Dual Supply: Electrical Characteristics 
    15. 5.15 ±5 V Dual Supply: Switching Characteristics 
    16. 5.16 Typical Characteristics
  7. Parameter Measurement Information
    1. 6.1  On-Resistance
    2. 6.2  Off-Leakage Current
    3. 6.3  On-Leakage Current
    4. 6.4  Transition Time
    5. 6.5  tON(EN) and tOFF(EN)
    6. 6.6  Break-Before-Make
    7. 6.7  tON (VDD) Time
    8. 6.8  Propagation Delay
    9. 6.9  Charge Injection
    10. 6.10 Off Isolation
    11. 6.11 Crosstalk
    12. 6.12 Bandwidth
    13. 6.13 THD + Noise
    14. 6.14 Power Supply Rejection Ratio (PSRR)
  8. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Bidirectional Operation
      2. 7.3.2 Rail to Rail Operation
      3. 7.3.3 1.8V Logic Compatible Inputs
      4. 7.3.4 Fail-Safe Logic
      5. 7.3.5 Latch-Up Immune
      6. 7.3.6 Ultra-Low Charge Injection
    4. 7.4 Device Functional Modes
    5. 7.5 Truth Tables
  9. Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 PWM Signal Generation (EV Charging Station)
      2. 8.2.2 Design Requirements
      3. 8.2.3 Detailed Design Procedure
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. Device and Documentation Support
    1. 9.1 Documentation Support
      1. 9.1.1 Related Documentation
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)

Device Functional Modes

When the EN pin of the TMUX6219-Q1 is pulled high, one of the switches is closed based on the state of the SEL pin. When the EN pin is pulled low, both of the switches are in an open state regardless of the state of the SEL pin. The control pins can be as high as 36V.

The TMUX6219-Q1 can be operated without any external components except for the supply decoupling capacitors. The EN pin has an internal pull-up resistor of 4 MΩ and SEL pin has internal pull-down resistor of 4 MΩ. If unused, the EN pin must be tied to VDD and SEL pin must be tied to GND to ensure the device does not consume additional current as highlighted in Implications of Slow or Floating CMOS Inputs. Unused signal path inputs (S1, S2, or D) should be connected to GND.