SCDS449C April   2022  – February 2024 TMUX6236

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Thermal Information
    4. 5.4  Recommended Operating Conditions
    5. 5.5  Source or Drain Continuous Current
    6. 5.6  ±15V Dual Supply: Electrical Characteristics 
    7. 5.7  ±15V Dual Supply: Switching Characteristics 
    8. 5.8  36V Single Supply: Electrical Characteristics 
    9. 5.9  36V Single Supply: Switching Characteristics 
    10. 5.10 12V Single Supply: Electrical Characteristics 
    11. 5.11 12V Single Supply: Switching Characteristics 
    12. 5.12 ±5V Dual Supply: Electrical Characteristics 
    13. 5.13 ±5V Dual Supply: Switching Characteristics 
    14. 5.14 Typical Characteristics
  7. 6 Parameter Measurement Information
    1. 6.1  On-Resistance
    2. 6.2  Off-Leakage Current
    3. 6.3  On-Leakage Current
    4. 6.4  Transition Time
    5. 6.5  tON(EN) and tOFF(EN)
    6. 6.6  Break-Before-Make
    7. 6.7  tON (VDD) Time
    8. 6.8  Propagation Delay
    9. 6.9  Charge Injection
    10. 6.10 Off Isolation
    11. 6.11 Crosstalk
    12. 6.12 Bandwidth
    13. 6.13 THD + Noise
    14. 6.14 Power Supply Rejection Ratio (PSRR)
  8. 7 Detailed Description
    1. 7.1 Functional Block Diagram
    2. 7.2 Feature Description
      1. 7.2.1 Bidirectional Operation
      2. 7.2.2 Rail to Rail Operation
      3. 7.2.3 1.8V Logic Compatible Inputs
      4. 7.2.4 Integrated Pull-Down Resistor on Logic Pins
      5. 7.2.5 Fail-Safe Logic
      6. 7.2.6 Latch-Up Immune
      7. 7.2.7 Ultra-Low Charge Injection
    3. 7.3 Device Functional Modes
    4. 7.4 Truth Tables
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curve
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Documentation Support
      1. 9.1.1 Related Documentation
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Glossary
    6. 9.6 Electrostatic Discharge Caution
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • PW|16
  • RUM|16
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4 Pin Configuration and Functions

GUID-4F214FE3-25A2-4EB2-BAB1-4F613C7BA732-low.svgFigure 4-1 RUM Package,16-Pin WQFN(Top View)
Figure 4-2 PW Package,16-Pin TSSOP(Top View)
Table 4-1 Pin Functions
PINTYPE(1)DESCRIPTION
NAMETSSOPWQFN
D131I/ODrain pin. Can be an input or output.
D2119I/ODrain pin. Can be an input or output.
EN1412IActive high logic enable, has internal pull-up resistor. When this pin is low, all switches are turned off. When this pin is high, the SEL logic input determine which switch is turned on.
GND64PGround (0V) reference
NC

7, 8, 15, 16

5, 7, 13, 14

—No internal connection. Can be shorted to GND or left floating.
S1A

2

16

I/OSource pin 1A. Can be an input or output.
S1B

4

2

I/OSource pin 1B. Can be an input or output.
S2A10

8

I/OSource pin 2A. Can be an input or output.
S2B12

10

I/OSource pin 2B. Can be an input or output.
SEL1115ILogic control input, has internal pull-down resistor. Table 7-1 lists how to control the switch connection.
SEL296ILogic control input, has internal pull-down resistor. Table 7-1 lists how to control the switch connection.
VDD1311PPositive power supply. This pin is the most positive power-supply potential. For reliable operation, connect a decoupling capacitor ranging from 0.1µF to 10µF between VDD and GND.
VSS53PNegative power supply. This pin is the most negative power-supply potential. In single-supply applications, this pin can be connected to ground. For reliable operation, connect a decoupling capacitor ranging from 0.1µF to 10µF between VSS and GND.
Thermal Pad—The thermal pad is not connected internally. There is no requirement to electrically connect this pad. If connected, however, it is recommended that the pad be left floating or tied to GND.
(1) I = input, O = output, P = power