SCDS400B march   2022  – july 2023 TMUX7348F , TMUX7349F

PRODMIX  

  1.   1
  2. Features
  3. Applications
  4. Description
  5. Revision History
  6. Device Comparison Table
  7. Pin Configuration and Functions
  8. Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3  Thermal Information
    4. 7.4  Recommended Operating Conditions
    5. 7.5  Electrical Characteristics (Global)
    6. 7.6  ±15 V Dual Supply: Electrical Characteristics
    7. 7.7  ±20 V Dual Supply: Electrical Characteristics
    8. 7.8  12 V Single Supply: Electrical Characteristics
    9. 7.9  36 V Single Supply: Electrical Characteristics
    10. 7.10 Typical Characteristics
  9. Parameter Measurement Information
    1. 8.1  On-Resistance
    2. 8.2  Off-Leakage Current
    3. 8.3  On-Leakage Current
    4. 8.4  Input and Output Leakage Current Under Overvoltage Fault
    5. 8.5  Break-Before-Make Delay
    6. 8.6  Enable Delay Time
    7. 8.7  Transition Time
    8. 8.8  Fault Response Time
    9. 8.9  Fault Recovery Time
    10. 8.10 Fault Flag Response Time
    11. 8.11 Fault Flag Recovery Time
    12. 8.12 Charge Injection
    13. 8.13 Off Isolation
    14. 8.14 Crosstalk
    15. 8.15 Bandwidth
    16. 8.16 THD + Noise
  10. Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1 Flat ON- Resistance
      2. 9.3.2 Protection Features
        1. 9.3.2.1 Input Voltage Tolerance
        2. 9.3.2.2 Powered-Off Protection
        3. 9.3.2.3 Fail-Safe Logic
        4. 9.3.2.4 Overvoltage Protection and Detection
        5. 9.3.2.5 Adjacent Channel Operation During Fault
        6. 9.3.2.6 ESD Protection
        7. 9.3.2.7 Latch-Up Immunity
        8. 9.3.2.8 EMC Protection
      3. 9.3.3 Overvoltage Fault Flags
      4. 9.3.4 Bidirectional and Rail-to-Rail Operation
      5. 9.3.5 1.8 V Logic Compatible Inputs
      6. 9.3.6 Integrated Pull-Down Resistor on Logic Pins
    4. 9.4 Device Functional Modes
      1. 9.4.1 Normal Mode
      2. 9.4.2 Fault Mode
      3. 9.4.3 Truth Tables
  11. 10Application and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Application
      1. 10.2.1 Design Requirements
      2. 10.2.2 Detailed Design Procedure
      3. 10.2.3 Application Curves
    3. 10.3 Power Supply Recommendations
    4. 10.4 Layout
      1. 10.4.1 Layout Guidelines
      2. 10.4.2 Layout Example
  12. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 Receiving Notification of Documentation Updates
    3. 11.3 Support Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  13. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Adjacent Channel Operation During Fault

When the logic pins are set to a channel under a fault, the overvoltage detection will trigger, the switch will open, and the drain pin will be pulled up or down as described in Section 9.3.2.4. During such an event, all other channels not under a fault can continue to operate as normal. For example, if S1 voltage exceeds VFP, and the logic pins are set to S1, the drain output is pulled to VFP. Then if the logic pins are changed to set S4, which is not in overvoltage or undervoltage, the drain will disconnect from the pullup to VFP and the S4 switch will be enabled and connected to the drain, operating as normal. If the logic pins are switched back to S1, the S4 switch will be disabled, the drain pin will be pulled up to VFP again, and the switch from S1 to drain will not be enabled until the overvoltage fault is removed.