SCDS459A October   2022  – November 2022 TMUX7436F

PRODMIX  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Thermal Information
    4. 6.4  Recommended Operating Conditions
    5. 6.5  Electrical Characteristics: Global
    6. 6.6  ±15 V Dual Supply: Electrical Characteristics
    7. 6.7  ±20 V Dual Supply: Electrical Characteristics
    8. 6.8  12 V Single Supply: Electrical Characteristics
    9. 6.9  36 V Single Supply: Electrical Characteristics
    10. 6.10 Typical Characteristics
  7. 7 Parameter Measurement Information
    1. 7.1  On-Resistance
    2. 7.2  Off-Leakage Current
    3. 7.3  On-Leakage Current
    4. 7.4  Input and Output Leakage Current Under Overvoltage Fault
    5. 7.5  Enable Delay Time
    6. 7.6  Break-Before-Make Delay
    7. 7.7  Transition Time
    8. 7.8  Fault Response Time
    9. 7.9  Fault Recovery Time
    10. 7.10 Fault Flag Response Time
    11. 7.11 Fault Flag Recovery Time
    12. 7.12 Charge Injection
    13. 7.13 Off Isolation
    14. 7.14 Crosstalk
    15. 7.15 Bandwidth
    16. 7.16 THD + Noise
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Flat ON-Resistance
      2. 8.3.2 Protection Features
        1. 8.3.2.1 Input Voltage Tolerance
        2. 8.3.2.2 Powered-Off Protection
        3. 8.3.2.3 Fail-Safe Logic
        4. 8.3.2.4 Overvoltage Protection and Detection
        5. 8.3.2.5 Adjacent Channel Operation During Fault
        6. 8.3.2.6 ESD Protection
        7. 8.3.2.7 Latch-Up Immunity
        8. 8.3.2.8 EMC Protection
      3. 8.3.3 Overvoltage Fault Flags
      4. 8.3.4 Bidirectional Operation
      5. 8.3.5 1.8 V Logic Compatible Inputs
      6. 8.3.6 Integrated Pull-Down Resistor on Logic Pins
    4. 8.4 Device Functional Modes
      1. 8.4.1 Normal Mode
      2. 8.4.2 Fault Mode
      3. 8.4.3 Truth Tables
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 Receiving Notification of Documentation Updates
    3. 12.3 Support Resources
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

12.5 Electrostatic Discharge Caution

GUID-D6F43A01-4379-4BA1-8019-E75693455CED-low.gif This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.