SCDS459A October   2022  – November 2022 TMUX7436F

PRODMIX  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Thermal Information
    4. 6.4  Recommended Operating Conditions
    5. 6.5  Electrical Characteristics: Global
    6. 6.6  ±15 V Dual Supply: Electrical Characteristics
    7. 6.7  ±20 V Dual Supply: Electrical Characteristics
    8. 6.8  12 V Single Supply: Electrical Characteristics
    9. 6.9  36 V Single Supply: Electrical Characteristics
    10. 6.10 Typical Characteristics
  7. 7 Parameter Measurement Information
    1. 7.1  On-Resistance
    2. 7.2  Off-Leakage Current
    3. 7.3  On-Leakage Current
    4. 7.4  Input and Output Leakage Current Under Overvoltage Fault
    5. 7.5  Enable Delay Time
    6. 7.6  Break-Before-Make Delay
    7. 7.7  Transition Time
    8. 7.8  Fault Response Time
    9. 7.9  Fault Recovery Time
    10. 7.10 Fault Flag Response Time
    11. 7.11 Fault Flag Recovery Time
    12. 7.12 Charge Injection
    13. 7.13 Off Isolation
    14. 7.14 Crosstalk
    15. 7.15 Bandwidth
    16. 7.16 THD + Noise
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Flat ON-Resistance
      2. 8.3.2 Protection Features
        1. 8.3.2.1 Input Voltage Tolerance
        2. 8.3.2.2 Powered-Off Protection
        3. 8.3.2.3 Fail-Safe Logic
        4. 8.3.2.4 Overvoltage Protection and Detection
        5. 8.3.2.5 Adjacent Channel Operation During Fault
        6. 8.3.2.6 ESD Protection
        7. 8.3.2.7 Latch-Up Immunity
        8. 8.3.2.8 EMC Protection
      3. 8.3.3 Overvoltage Fault Flags
      4. 8.3.4 Bidirectional Operation
      5. 8.3.5 1.8 V Logic Compatible Inputs
      6. 8.3.6 Integrated Pull-Down Resistor on Logic Pins
    4. 8.4 Device Functional Modes
      1. 8.4.1 Normal Mode
      2. 8.4.2 Fault Mode
      3. 8.4.3 Truth Tables
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 Receiving Notification of Documentation Updates
    3. 12.3 Support Resources
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1)
MIN MAX UNIT
VDD to VSS Supply voltage 48 V
VDD to GND –0.3 48 V
VSS to GND –48 0.3 V
VS to GND Source input pin (Sx) voltage to GND –65 65 V
VS to VDD Source input pin (Sx) voltage to VDD –90 V
VS to VSS Source input pin (Sx) voltage to VSS 90 V
VD Drain pin (Dx) voltage VSS–0.7 VDD+0.7 V
VLOGIC Logic control input pin voltage (EN, SELx, DR)(2) GND –0.7 48 V
VxF Logic output pin voltage (FF, SF)(2) GND –0.7 6 V
ILOGIC Logic control input pin current (EN, SELx, DR)(2) –30 30 mA
IxF Logic output pin current (FF, SF)(2) –10 10 mA
IS or ID (CONT) Source or drain continuous current (Sx or Dx) IDC ± 10 %(3) IDC ± 10 %(3) mA
Tstg Storage temperature –65 150 °C
TA Ambient temperature –55 150 °C
TJ Junction temperature 150 °C
Ptot(5) Total power dissipation (TSSOP) 650 mW
(1) Operation outside the Absolute Maximum Ratings may cause permanent device damage. Absolute maximum ratings do not imply functional operation of the device at these or any other conditions beyond those listed under Recommended Operating Conditions. If briefly operating outside the Recommended Operating Conditions but within the Absolute Maximum Ratings, the device may not sustain damage, but it may not be fully functional. Operating the device in this manner may affect device reliability, functionality, performance, and shorten the device lifetime.
(2) Stresses have to be kept at or below both voltage and current ratings at all time.
(3) Refer to Recommended Operating Conditions for IDC ratings.
(4) For TSSOP package: Ptot derates linearly above TA = 70°C by 10.1 mW/°C.