SCDS467 august   2023 TMUX7612-Q1

ADVANCE INFORMATION  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Revision History
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Thermal Information
    4. 6.4  Recommended Operating Conditions
    5. 6.5  Source or Drain Continuous Current Switch Pairs
    6. 6.6  Source or Drain Pulsed Current
    7. 6.7  Electrical Characteristics (12 V Single Supply)
    8. 6.8  Switching Characteristics (12 V Single Supply)
    9. 6.9  Electrical Characteristics (±15 V Dual Supply)
    10. 6.10 Switching Characteristics (±15 V Dual Supply)
    11. 6.11 Electrical Characteristics (±20 V Dual Supply)
    12. 6.12 Switching Characteristics (±20 V Dual Supply)
    13. 6.13 Electrical Characteristics (+37.5 V/–12.5 V Dual Supply)
    14. 6.14 Switching Characteristics (+37.5 V/–12.5 V Dual Supply)
    15. 6.15 Electrical Characteristics (48 V Single Supply)
    16. 6.16 Switching Characteristics (48 V Single Supply)
    17. 6.17 Typical Characteristics
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Bidirectional Operation
      2. 7.3.2 Rail-to-Rail Operation
      3. 7.3.3 1.8 V Logic Compatible Inputs
      4. 7.3.4 Flat On-Resistance
      5. 7.3.5 Power-Up Sequence Free
      6. 7.3.6 Ultra-Low Charge Injection
      7. 7.3.7 Ultra-Low Leakage Current
    4. 7.4 Device Functional Modes
      1. 7.4.1 Truth Tables
  9. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Typical Application – MEMs Lidar Switching
    2. 8.2 Design Requirements
    3. 8.3 Detailed Design Procedure
    4. 8.4 Application Curve
    5. 8.5 Power Supply Recommendations
    6. 8.6 Layout
      1. 8.6.1 Layout Guidelines
      2. 8.6.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Documentation Support
      1. 9.1.1 Related Documentation
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  11. 10Mechanical, Packaging, and Orderable Information
    1. 10.1 Tape and Reel Information
    2. 10.2 Mechanical Data

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • PW|16
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5 Pin Configuration and Functions

GUID-20220907-SS0I-F3MG-DKTX-XN39RN1GXRDV-low.svgFigure 5-1 PW Package, 16-Pin TSSOP (Top View)
Table 5-1 Pin Functions
PIN TYPE(1) DESCRIPTION
NAME NO.
D1 2 I/O Drain pin 1. Can be an input or output.
D2 15 I/O Drain pin 2. Can be an input or output.
D3 10 I/O Drain pin 3. Can be an input or output.
D4 7 I/O Drain pin 4. Can be an input or output.
GND 5 P Ground (0 V) reference.
N.C. 12 — No internal connection. Can be shorted to GND or left floating
S1 3 I/O Source pin 1. Can be an input or output.
S2 14 I/O Source pin 2. Can be an input or output.
S3 11 I/O Source pin 3. Can be an input or output.
S4 6 I/O Source pin 4. Can be an input or output.
SEL1 1 I Logic control input 1, has internal pull-down resistor. Controls channel 1 state as provided in Table 7-1.
SEL2 16 I Logic control input 2, has internal pull-down resistor. Controls channel 2 state as provided in Table 7-1.
SEL3 9 I Logic control input 3, has internal pull-down resistor. Controls channel 3 state as provided in Table 7-1.
SEL4 8 I Logic control input 4, has internal pull-down resistor. Controls channel 4 state as provided in Table 7-1.
VDD 13 P Positive power supply. This pin is the most positive power-supply potential. For reliable operation, connect a decoupling capacitor ranging from 0.1 µF to 10 µF between VDD and GND
VSS 4 P Negative power supply. This pin is the most negative power-supply potential. For reliable operation, connect a decoupling capacitor ranging from 0.1 μF to 10 μF between VSS and GND. In single-supply applications, this pin should be connected to ground.
Thermal Pad — The thermal exposed pad is connected internally. It is recommended that the pad be tied to VSS for best performance.
(1) I = input, O = output, I/O = input and output, P = power.