SCDS435B september   2021  – august 2023 TMUX8108 , TMUX8109

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Revision History
  6. 5 Device Comparison Table
  7. 6 Pin Configuration and Functions
  8. 7 Specifications
    1. 7.1  Absolute Maximum Ratings: TMUX810x Devices
    2. 7.2  ESD Ratings
    3. 7.3  Recommended Operating Conditions: TMUX810x Devices
    4. 7.4  Thermal Information
    5. 7.5  Electrical Characteristics (Global): TMUX810x Devices
    6. 7.6  Electrical Characteristics (±15-V Dual Supply)
    7. 7.7  Electrical Characteristics (±36-V Dual Supply)
    8. 7.8  Electrical Characteristics (±50-V Dual Supply)
    9. 7.9  Electrical Characteristics (72-V Single Supply)
    10. 7.10 Electrical Characteristics (100-V Single Supply)
    11. 7.11 Switching Characteristics: TMUX810x Devices
    12. 7.12 Typical Characteristics
  9. 8 Parameter Measurement Information
    1. 8.1  On-Resistance
    2. 8.2  Off-Leakage Current
    3. 8.3  On-Leakage Current
    4. 8.4  Break-Before-Make Delay
    5. 8.5  Enable Turn-on and Turn-off Time
    6. 8.6  Transition Time
    7. 8.7  Charge Injection
    8. 8.8  Off Isolation
    9. 8.9  Crosstalk
    10. 8.10 Bandwidth
    11. 8.11 THD + Noise
  10. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1 Bidirectional Operation
      2. 9.3.2 Flat On – Resistance
      3. 9.3.3 Protection Features
        1. 9.3.3.1 Fail-Safe Logic
        2. 9.3.3.2 ESD Protection
        3. 9.3.3.3 Latch-Up Immunity
      4. 9.3.4 1.8 V Logic Compatible Inputs
      5. 9.3.5 Integrated Pull-Down Resistor on Logic Pins
    4. 9.4 Device Functional Modes
      1. 9.4.1 Normal Mode
      2. 9.4.2 Truth Tables
  11. 10Application and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Application
      1. 10.2.1 Design Requirements
      2. 10.2.2 Detailed Design Procedure
      3. 10.2.3 Application Curves
    3. 10.3 Power Supply Recommendations
    4. 10.4 Layout
      1. 10.4.1 Layout Guidelines
      2. 10.4.2 Layout Example
  12. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 Receiving Notification of Documentation Updates
    3. 11.3 Support Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  13. 12Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • PW|16
  • RUM|16
Thermal pad, mechanical data (Package|Pins)
Orderable Information

10.4.1 Layout Guidelines

The following images illustrate an example of a PCB layout with the TMUX8108 and TMUX8109. Some key considerations are:

  • For reliable operation, connect at least one decoupling capacitor ranging from 0.1 µF to 10 µF between VDD and VSS to GND. We recommend a 0.1 µF and 1 µF capacitor, placing the lowest value capacitor as close to the pin as possible. Make sure that the capacitor voltage rating is sufficient for the supply voltage.
  • Keep the input lines as short as possible.
  • Use a solid ground plane to help distribute heat and reduce electromagnetic interference (EMI) noise pickup.
  • Do not run sensitive analog traces in parallel with digital traces. Avoid crossing digital and analog traces if possible, and only make perpendicular crossings when necessary.