SCDS470 june   2023 TMUX9832

ADVANCE INFORMATION  

  1.   1
  2. 1Features
  3. 2Applications
  4. 3Description
  5. 4Revision History
  6. 5Device and Documentation Support
    1. 5.1 Receiving Notification of Documentation Updates
    2. 5.2 Support Resources
    3. 5.3 Trademarks
    4. 5.4 Electrostatic Discharge Caution
    5. 5.5 Glossary
  7. 6Mechanical, Packaging, and Orderable Information
    1. 6.1 Mechanical Data
    2. 6.2 Tape and Reel Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • ZEH|83
  • RWF|72
Thermal pad, mechanical data (Package|Pins)
Orderable Information

1 Features

  • Only +5 V bias supply required
    • Very low power: 9.5 mW (typ) all 32CH switching at 50 kHz
  • Wide input signal range:
    • Up to ±110 V, 220 VPP
    • ±120 V, 240 VPP voltage overshoots supported
  • Low off capacitance: 10.6 pF
  • Low on resistance
  • Up to 100 MHz data shift clock frequency
  • Logic levels: 1.8 V to 5 V
  • Integrated NDIN to invert input data polarity
  • Fast turn-on time: 3 μs (maximum)
  • Excellent HD2PC performance: -65 dB at 5 MHz
  • Small BGA and QFN package options with optimized pin-out
  • Integrated thermal shutdown for improved system reliability
  • Integrated bleed resistors on the outputs
  • Latch-up immunity by device construction
  • Extended temperature range: –40°C to 125°C