SLASF92 july   2023 TMUXHS221LV

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Revision History
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Electrical Characteristics
    6. 6.6  High-Speed Performance Parameters
    7. 6.7  Switching Characteristics
    8. 6.8  Typical Characteristics – S-Parameters
    9. 6.9  Typical Characteristics – RON
    10. 6.10 Typical Characteristics – Eye Diagrams
    11.     18
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Output Enable and Power Savings
      2. 7.3.2 Data Line Biasing
    4. 7.4 Device Functional Modes
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Applications
      1. 8.2.1 Routing Debug Signals to USB Port
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
        3. 8.2.1.3 Application Curves
      2. 8.2.2 Systems Examples
        1. 8.2.2.1 PCIe Clock Muxing
        2. 8.2.2.2 USB-C SBU Muxing
        3. 8.2.2.3 Switching USB Port
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Related Documentation
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  11. 10Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.4 Thermal Information

THERMAL METRIC(1) TMUXHS221LV UNIT
NKG (UQFN)
10 PINS
RθJA Junction-to-ambient thermal resistance - High K 225.9 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 93.5 °C/W
RθJB Junction-to-board thermal resistance 147.5 °C/W
ψJT Junction-to-top characterization parameter 3.4 °C/W
ψJB Junction-to-board characterization parameter 147.1 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.