SCDS453B June   2024  – September 2024 TMUXS7614D

PRODUCTION DATA  

  1.   1
  2. Features
  3. Applications
  4. Description
  5. Pin Configuration and Functions
  6. Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Thermal Information
    4. 5.4  Recommended Operating Conditions
    5. 5.5  Source or Drain Current through Switch
    6. 5.6  Electrical Characteristics (Global)
    7. 5.7  Electrical Characteristics (±15 V Dual Supply)
    8. 5.8  Switching Characteristics (±15 V Dual Supply)
    9. 5.9  Electrical Characteristics (±20 V Dual Supply)
    10. 5.10 Switching Characteristics (±20 V Dual Supply)
    11. 5.11 Electrical Characteristics (+37.5 V/–12.5 V Dual Supply)
    12. 5.12 Switching Characteristics (+37.5 V/–12.5 V Dual Supply)
    13. 5.13 Electrical Characteristics (12 V Single Supply)
    14. 5.14 Switching Characteristics (12 V Single Supply)
    15. 5.15 SPI Timing Characteristics (2.7 V to 5.5 V)
    16. 5.16 SPI Timing Characteristics (1.8 V to 2.7 V)
    17. 5.17 Timing Diagrams
    18. 5.18 Typical Characteristics
  7. Parameter Measurement Information
    1. 6.1  On-Resistance
    2. 6.2  Off-Leakage Current
    3. 6.3  On-Leakage Current
    4. 6.4  tON and tOFF Time
    5. 6.5  Break-Before-Make
    6. 6.6  Charge Injection
    7. 6.7  Off Isolation
    8. 6.8  Channel-to-Channel Crosstalk
    9. 6.9  Bandwidth
    10. 6.10 THD + Noise
  8. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Bidirectional Operation
      2. 7.3.2 Rail-to-Rail Operation
      3. 7.3.3 1.8V Logic Compatible Inputs
      4. 7.3.4 Flat On-Resistance
      5. 7.3.5 Power-Up Sequence Free
    4. 7.4 SPI Operation
      1. 7.4.1 Address Mode
      2. 7.4.2 Burst Mode
      3. 7.4.3 Daisy Chain Mode
      4. 7.4.4 Error Detection
        1. 7.4.4.1 Address R/W Error Flag
        2. 7.4.4.2 SCLK Count Error Flag
        3. 7.4.4.3 CRC (Cyclic Redundancy Check) Enable and Error Flag
        4. 7.4.4.4 Clearing Error Flags
      5. 7.4.5 Software Reset
    5. 7.5 Device Functional Modes
    6. 7.6 Register Map
  9. Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curve
    3. 8.3 Thermal Considerations
    4. 8.4 Power Supply Recommendations
    5. 8.5 Layout
      1. 8.5.1 Layout Guidelines
      2. 8.5.2 Layout Example
  10. Device and Documentation Support
    1. 9.1 Documentation Support
      1. 9.1.1 Related Documentation
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information
    1. 11.1 Tape and Reel Information
    2. 11.2 Mechanical Data

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • ZEM|30
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Detailed Design Procedure

Figure 10-1 demonstrates how the TMUXS7614D can be used in semiconductor test equipment for high-precision, high-voltage, multi-channel measurement applications. The TMUXS7614D can support 1.8V logic signals on the control input, allowing the device to interface with low logic controls of an FPGA or MCU. The TMUXS7614D can operate without any external components except for the supply decoupling capacitors. The select pins have an internal pull-down resistor to prevent floating input logic. All inputs to the switch must fall within the recommend operating conditions of the TMUXS7614D including signal range and continuous current. For this design with a positive supply of 37.5V on VDD and negative supply of -12.5V on VSS, the signal range can be 32.5V to -7.5V. The maximum continuous current (IDC) can be up to 470mA as shown in the Recommended Operating Conditions table for wide-range current measurement.