SLOS417D October   2003  – November 2015 TPA2010D1

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Device Comparison Table
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Operating Characteristics
    7. 6.7 Dissipation Ratings
    8. 6.8 Typical Characteristics
  7. 7 Parameter Measurement Information
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Fully Differential Amplifier
      2. 8.3.2 Advantages of Fully Differential Amplifiers
      3. 8.3.3 Efficiency and Thermal Information
      4. 8.3.4 Eliminating the Output Filter With the TPA2010D1
        1. 8.3.4.1 Effect on Audio
        2. 8.3.4.2 Traditional Class-D Modulation Scheme
        3. 8.3.4.3 TPA2010D1 Modulation Scheme
        4. 8.3.4.4 Efficiency: Use a Filter With the Traditional Class-D Modulation Scheme
        5. 8.3.4.5 Effects of Applying a Square Wave into a Speaker
        6. 8.3.4.6 When to Use an Output Filter
    4. 8.4 Device Functional Modes
      1. 8.4.1 Summing Input Signals with the TPA2010D1
        1. 8.4.1.1 Summing Two Differential Inputs
        2. 8.4.1.2 Summing a Differential Input Signal and a Single-Ended Input Signal
        3. 8.4.1.3 TPA2010D1 Summing Two Single-Ended Inputs
      2. 8.4.2 Shutdown Mode
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Applications
      1. 9.2.1 TPA200110D1 With Differential Input
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
          1. 9.2.1.2.1 Input Resistors (RI)
          2. 9.2.1.2.2 Decoupling Capacitor (CS)
        3. 9.2.1.3 Application Curves
      2. 9.2.2 TPA20010D1 With Differential Input and Input Capacitors
        1. 9.2.2.1 Design Requirements
        2. 9.2.2.2 Detailed Design Procedure
          1. 9.2.2.2.1 Input Capacitors (CI)
        3. 9.2.2.3 Application Curves
      3. 9.2.3 TPA20010D1 with Single-Ended Input
        1. 9.2.3.1 Design Requirements
        2. 9.2.3.2 Detailed Design Procedure
        3. 9.2.3.3 Application Curves
  10. 10Power Supply Recommendations
    1. 10.1 Power Supply Decoupling Capacitors
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Board Layout
      1. 11.2.1 Component Location
      2. 11.2.2 Trace Width
    3. 11.3 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Device Support
      1. 12.1.1 Third-Party Products Disclaimer
    2. 12.2 Community Resources
    3. 12.3 Trademarks
    4. 12.4 Electrostatic Discharge Caution
    5. 12.5 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

12 Device and Documentation Support

12.1 Device Support

12.1.1 Third-Party Products Disclaimer

TI'S PUBLICATION OF INFORMATION REGARDING THIRD-PARTY PRODUCTS OR SERVICES DOES NOT CONSTITUTE AN ENDORSEMENT REGARDING THE SUITABILITY OF SUCH PRODUCTS OR SERVICES OR A WARRANTY, REPRESENTATION OR ENDORSEMENT OF SUCH PRODUCTS OR SERVICES, EITHER ALONE OR IN COMBINATION WITH ANY TI PRODUCT OR SERVICE.

12.2 Community Resources

The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use.

    TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers.
    Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and contact information for technical support.

12.3 Trademarks

NanoFree, NanoStar, E2E are trademarks of Texas Instruments.

All other trademarks are the property of their respective owners.

12.4 Electrostatic Discharge Caution

esds-image

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates.

12.5 Glossary

SLYZ022 — TI Glossary.

This glossary lists and explains terms, acronyms, and definitions.