SLOS638C November   2011  – June 2022 TPA2015D1

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Device Comparison Table
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Operating Characteristics
    7. 7.7 Typical Characteristics
  8. 8 Parameter Measurement Information
  9. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1 SpeakerGuard™ Theory of Operation
        1. 9.3.1.1 SpeakerGuard™ With Varying Input Levels
        2. 9.3.1.2 Battery Tracking SpeakerGuard™
      2. 9.3.2 Fully Differential Class-D Amplifier
        1. 9.3.2.1 Advantages of Fully Differential Amplifiers
        2. 9.3.2.2 Improved Class-D Efficiency
      3. 9.3.3 Adaptive Boost Converter
        1. 9.3.3.1 Boost Converter Overvoltage Protection
      4. 9.3.4 Operation With DACs and CODECs
      5. 9.3.5 Filter Free Operation and Ferrite Bead Filters
      6. 9.3.6 Speaker Load Limitation
      7. 9.3.7 Fixed Gain Setting
    4. 9.4 Device Functional Modes
      1. 9.4.1 Shutdown Mode
      2. 9.4.2 Battery Tracking SpeakerGuard™ Operation
  10. 10Application and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Applications
      1. 10.2.1 TPA2015D1 With Differential Input Signals
        1. 10.2.1.1 Design Requirements
        2. 10.2.1.2 Detailed Design Procedure
          1. 10.2.1.2.1 Boost Converter Inductor Selection
            1. 10.2.1.2.1.1 Inductor Equations
          2. 10.2.1.2.2 Boost Converter Capacitor Selection
          3. 10.2.1.2.3 Components Location and Selection
            1. 10.2.1.2.3.1 Decoupling Capacitors
            2. 10.2.1.2.3.2 Input Capacitors
        3. 10.2.1.3 Application Curves
      2. 10.2.2 TPA2015D1 with Single-Ended Input Signals
        1. 10.2.2.1 Design Requirements
        2. 10.2.2.2 Detailed Design Procedure
        3. 10.2.2.3 Application Curves
  11. 11Power Supply Recommendations
    1. 11.1 Power Supply Decoupling Capacitors
  12. 12Layout
    1. 12.1 Layout Guidelines
      1. 12.1.1 Component Placement
      2. 12.1.2 Trace Width
      3. 12.1.3 Pad Size
    2. 12.2 Layout Example
  13. 13Device and Documentation Support
    1. 13.1 Device Support
      1. 13.1.1 Device Nomenclature
        1. 13.1.1.1 TPA2015D1 Glossary
        2. 13.1.1.2 Boost Terms
    2. 13.2 Community Resources
    3. 13.3 Trademarks
  14. 14Mechanical, Packaging, and Orderable Information
    1. 14.1 Package Option Addendum
      1. 14.1.1 Packaging Information
      2. 14.1.2 Tape and Reel Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

14.1.1 Packaging Information

Orderable DeviceStatus (1)Package TypePackage DrawingPinsPackage QtyEco Plan (2)Lead/Ball Finish(4)MSL Peak Temp (3)Op Temp (°C)Device Marking(5)(6)
SN012020YZHRACTIVEDSBGAYZH163000Green (RoHS & no Sb/Br)SNAGCULevel-1-260C-UNLIM–40 to 851D8
SN012020YZHTACTIVEDSBGAYZH16250Green (RoHS & no Sb/Br)SNAGCULevel-1-260C-UNLIM–40 to 851D8
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PRE_PROD Unannounced device, not in production, not available for mass market, nor on the web, samples not available.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width.
(5) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device
(6) Multiple Device markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device.
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