SLOS638C November   2011  – June 2022 TPA2015D1

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Device Comparison Table
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Operating Characteristics
    7. 7.7 Typical Characteristics
  8. 8 Parameter Measurement Information
  9. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1 SpeakerGuard™ Theory of Operation
        1. 9.3.1.1 SpeakerGuard™ With Varying Input Levels
        2. 9.3.1.2 Battery Tracking SpeakerGuard™
      2. 9.3.2 Fully Differential Class-D Amplifier
        1. 9.3.2.1 Advantages of Fully Differential Amplifiers
        2. 9.3.2.2 Improved Class-D Efficiency
      3. 9.3.3 Adaptive Boost Converter
        1. 9.3.3.1 Boost Converter Overvoltage Protection
      4. 9.3.4 Operation With DACs and CODECs
      5. 9.3.5 Filter Free Operation and Ferrite Bead Filters
      6. 9.3.6 Speaker Load Limitation
      7. 9.3.7 Fixed Gain Setting
    4. 9.4 Device Functional Modes
      1. 9.4.1 Shutdown Mode
      2. 9.4.2 Battery Tracking SpeakerGuard™ Operation
  10. 10Application and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Applications
      1. 10.2.1 TPA2015D1 With Differential Input Signals
        1. 10.2.1.1 Design Requirements
        2. 10.2.1.2 Detailed Design Procedure
          1. 10.2.1.2.1 Boost Converter Inductor Selection
            1. 10.2.1.2.1.1 Inductor Equations
          2. 10.2.1.2.2 Boost Converter Capacitor Selection
          3. 10.2.1.2.3 Components Location and Selection
            1. 10.2.1.2.3.1 Decoupling Capacitors
            2. 10.2.1.2.3.2 Input Capacitors
        3. 10.2.1.3 Application Curves
      2. 10.2.2 TPA2015D1 with Single-Ended Input Signals
        1. 10.2.2.1 Design Requirements
        2. 10.2.2.2 Detailed Design Procedure
        3. 10.2.2.3 Application Curves
  11. 11Power Supply Recommendations
    1. 11.1 Power Supply Decoupling Capacitors
  12. 12Layout
    1. 12.1 Layout Guidelines
      1. 12.1.1 Component Placement
      2. 12.1.2 Trace Width
      3. 12.1.3 Pad Size
    2. 12.2 Layout Example
  13. 13Device and Documentation Support
    1. 13.1 Device Support
      1. 13.1.1 Device Nomenclature
        1. 13.1.1.1 TPA2015D1 Glossary
        2. 13.1.1.2 Boost Terms
    2. 13.2 Community Resources
    3. 13.3 Trademarks
  14. 14Mechanical, Packaging, and Orderable Information
    1. 14.1 Package Option Addendum
      1. 14.1.1 Packaging Information
      2. 14.1.2 Tape and Reel Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6 Pin Configuration and Functions

GUID-EF3DB259-86E3-4522-B557-CC12FC3E8348-low.gifFigure 6-1 YZH Package16-Pin DSBGATop View
Table 6-1 Pin Functions
PIN TYPE(1) DESCRIPTION
NAME NO.
AGC B3 I Enable and select AGC.
ENB D4 I Enable for the boost converter; set to logic high to enable.
END C3 I Enable for the Class-D amplifier; set to logic high to enable.
GAIN B2 I Gain selection pin.
GND A4, C2, C4, D1 P Ground; all ground balls must be connected for proper functionality.
IN– D3 I Negative audio input.
IN+ D2 I Positive audio input.
OUT– C1 O Negative audio output.
OUT+ B1 O Positive audio output.
PVDD A1 I Class-D power stage supply voltage.
PVOUT A2 O Boost converter output.
SW A3 I Boost and rectifying switch input.
VBAT B4 P Supply voltage.
(1) I = Input, O = Output, P = Power