6.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)(1)
|
MIN |
MAX |
UNIT |
VCC |
Supply voltage |
AVCC, PVCC |
–0.3 |
30 |
V |
VI |
Interface pin voltage |
SD, GAIN0, GAIN1, PBTL, FAULT (2) |
–0.3 |
VCC + 0.3 |
V |
|
< 10 |
V/ms |
PLIMIT |
–0.3 |
GVDD + 0.3 |
V |
RINN, RINP, LINN, LINP |
–0.3 |
6.3 |
V |
|
Continuous total power dissipation |
See Thermal Information |
|
TA |
Operating free-air temperature |
–40 |
85 |
°C |
TJ |
Operating junction temperature(3) |
–40 |
150 |
°C |
RL |
Minimum load resistance |
BTL: PVCC > 15 V |
|
4.8 |
Ω |
BTL: PVCC ≤ 15 V |
|
3.2 |
PBTL |
|
3.2 |
Tstg |
Storage temperature |
–65 |
150 |
°C |
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) The voltage slew rate of these pins must be restricted to no more than 10 V/ms. For higher slew rates, use a 100-kΩ resister in series with the pins.
(3) The TPA3113D2 incorporates an exposed thermal pad on the underside of the chip. This acts as a heatsink, and it must be connected to a thermally dissipating plane for proper power dissipation. Failure to do so may result in the device going into thermal protection shutdown. See TI Technical Briefs
Quad Flatpack No-Lead Logic Packages for more information about using the TSSOP thermal pad.
6.2 ESD Ratings
|
VALUE |
UNIT |
V(ESD) |
Electrostatic discharge |
Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)(3) |
±2000 |
V |
Charged-device model (CDM), per JEDEC specification JESD22-C101(2)(4) |
±500 |
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
(3) In accordance with JEDEC Standard 22, Test Method A114-B.
(4) In accordance with JEDEC Standard 22, Test Method C101-A
6.4 Thermal Information
THERMAL METRIC(1)(2) |
TPA3113D2 |
UNIT |
PWP (TSSOP) |
28 PINS |
RθJA |
Junction-to-ambient thermal resistance |
30.3 |
°C/W |
RθJC(top) |
Junction-to-case (top) thermal resistance |
33.5 |
°C/W |
RθJB |
Junction-to-board thermal resistance |
17.5 |
°C/W |
ψJT |
Junction-to-top characterization parameter |
0.9 |
°C/W |
ψJB |
Junction-to-board characterization parameter |
7.2 |
°C/W |
RθJC(bot) |
Junction-to-case (bottom) thermal resistance |
0.9 |
°C/W |
(2) For thermal estimates of this device based on PCB copper area, see the PCB Thermal Calculator.