SLOS862B July   2015  – October 2016 TPA3116D2-Q1 , TPA3118D2-Q1

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 DC Electrical Characteristics
    6. 6.6 AC Electrical Characteristics
    7. 6.7 Timing Requirements
    8. 6.8 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  Gain Setting and Master and Slave
      2. 7.3.2  Input Impedance
      3. 7.3.3  Start-Up and Shutdown Operation
      4. 7.3.4  PLIMIT Operation
      5. 7.3.5  GVDD Supply
      6. 7.3.6  BSPx and BSNx Capacitors
      7. 7.3.7  Differential Inputs
      8. 7.3.8  Device Protection System
      9. 7.3.9  DC-Detect Protection
      10. 7.3.10 Short-Circuit Protection and Automatic Recovery Feature
      11. 7.3.11 Thermal Protection
      12. 7.3.12 TPA311xD2-Q1 Modulation Scheme
        1. 7.3.12.1 MODSEL = GND: BD Modulation
        2. 7.3.12.2 MODSEL = HIGH: 1SPW Modulation
      13. 7.3.13 AM Avoidance EMI Reduction
    4. 7.4 Device Functional Mode
      1. 7.4.1 Mono Mode (PBTL)
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Select the PWM Frequency
        2. 8.2.2.2 Select the Amplifier Gain and Master or Slave Mode
        3. 8.2.2.3 Select Input Capacitance
        4. 8.2.2.4 Select Decoupling Capacitors
        5. 8.2.2.5 Select Bootstrap Capacitors
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
    3. 10.3 Heat Sink Used on the EVM
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Third-Party Products Disclaimer
    2. 11.2 Related Links
    3. 11.3 Receiving Notification of Documentation Updates
    4. 11.4 Community Resources
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Trademarks
    7. 11.7 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

10 Layout

10.1 Layout Guidelines

Because the class-D switching edges are fast, it is necessary to take care when planning the layout of the printed circuit board. The following suggestions help to meet EMC requirements.

  • Decoupling capacitors — The high-frequency decoupling capacitors should be placed as close to the PVCC and AVCC terminals as possible. Large (100 μF or greater) bulk power supply decoupling capacitors should be placed near the TPA3116D2-Q1 on the PVCC supplies. Local, high-frequency bypass capacitors should be placed as close to the PVCC pins as possible. These capacitors can be connected to the IC GND pad directly for an excellent ground connection. Consider adding a small, good-quality, low-ESR ceramic capacitor between 220 pF and 1 nF and a larger mid-frequency capacitor of value between 100 nF and 1 µF, also of good quality, to the PVCC connections at each end of the chip.
  • Keep the current loop from each of the outputs through the filter and back to GND as small and tight as possible. The size of this current loop determines its effectiveness as an antenna.
  • Grounding — The PVCC decoupling capacitors should connect to GND. All ground should be connected at the IC GND, which should be used as a central ground connection or star ground for the TPA3116D2-Q1.
  • Output filter — The LC filter should be placed close to the outputs. The capacitor used in the LC filter should be grounded.

For an example layout, see the TPA3116D2 Evaluation Module (TPA3116D2EVM) User Guide (SLOU336). Both the EVM user manual and the thermal pad application reports, SLMA002 and SLMA004, are available on the TI Web site at http://www.ti.com.

10.2 Layout Example

TPA3116D2-Q1 TPA3118D2-Q1 layoutex1.png Figure 22. Layout Example Top
TPA3116D2-Q1 TPA3118D2-Q1 layoutex2.png Figure 23. Layout Example Bottom

10.3 Heat Sink Used on the EVM

The heat sink (part number ATS-TI 10 OP-521-C1-R1 or equivalent) used on the EVM is a 14-mm × 25-mm × 50-mm extruded aluminum heat sink with three fins (see Figure 24). For additional information on the heat sink, go to www.qats.com.

TPA3116D2-Q1 TPA3118D2-Q1 HEATSINK_USED_ON_EVM_los708.gif Figure 24. EVM Heatsink

This size heat sink has shown to be sufficient for continuous output power. The crest factor of music and having airflow lowers the requirement for heat sinking, and smaller types of heat sinks can be used.