SLOS708G April   2012  – December 2017 TPA3116D2 , TPA3118D2 , TPA3130D2

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 DC Electrical Characteristics
    6. 6.6 AC Electrical Characteristics
    7. 6.7 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  Gain Setting and Master and Slave
      2. 7.3.2  Input Impedance
      3. 7.3.3  Startup and Shutdown Operation
      4. 7.3.4  PLIMIT Operation
      5. 7.3.5  GVDD Supply
      6. 7.3.6  BSPx AND BSNx Capacitors
      7. 7.3.7  Differential Inputs
      8. 7.3.8  Device Protection System
      9. 7.3.9  DC Detect Protection
      10. 7.3.10 Short-Circuit Protection and Automatic Recovery Feature
      11. 7.3.11 Thermal Protection
      12. 7.3.12 Device Modulation Scheme
        1. 7.3.12.1 MODSEL = GND: BD-Modulation
        2. 7.3.12.2 MODSEL = HIGH: 1SPW-modulation
      13. 7.3.13 Efficiency: LC Filter Required with the Traditional Class-D Modulation Scheme
      14. 7.3.14 Ferrite Bead Filter Considerations
      15. 7.3.15 When to Use an Output Filter for EMI Suppression
      16. 7.3.16 AM Avoidance EMI Reduction
    4. 7.4 Device Functional Modes
      1. 7.4.1 Mono Mode (PBTL)
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Select the PWM Frequency
        2. 8.2.2.2 Select the Amplifier Gain and Master/Slave Mode
        3. 8.2.2.3 Select Input Capacitance
        4. 8.2.2.4 Select Decoupling Capacitors
        5. 8.2.2.5 Select Bootstrap Capacitors
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
    3. 10.3 Heat Sink Used on the EVM
  11. 11Device and Documentation Support
    1. 11.1 Related Links
    2. 11.2 Receiving Notification of Documentation Updates
    3. 11.3 Community Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5 Pin Configuration and Functions

DAD Package
32-Pin HTSSOP With PowerPAD Up
TPA3116D2 Only, Top View
TPA3116D2 TPA3118D2 TPA3130D2 TERMINAL_ASSIGNMENT_los708.gif
DAP Package
32-Pin HTSSOP With PowerPAD Down
Top View
TPA3116D2 TPA3118D2 TPA3130D2 TERMINAL_ASSIGNMENT2_los708.gif

Pin Functions

PIN TYPE(1) DESCRIPTION
NO. NAME
1 MODSEL I Mode selection logic input (LOW = BD mode, HIGH = 1 SPW mode). TTL logic levels with compliance to AVCC.
2 SDZ I Shutdown logic input for audio amp (LOW = outputs Hi-Z, HIGH = outputs enabled). TTL logic levels with compliance to AVCC.
3 FAULTZ DO General fault reporting including Over-temp, DC Detect. Open drain.
FAULTZ = High, normal operation
FAULTZ = Low, fault condition
4 RINP I Positive audio input for right channel. Biased at 3 V.
5 RINN I Negative audio input for right channel. Biased at 3 V.
6 PLIMIT I Power limit level adjust. Connect a resistor divider from GVDD to GND to set power limit. Connect directly to GVDD for no power limit.
7 GVDD PO Internally generated gate voltage supply. Not to be used as a supply or connected to any component other than a 1 µF X7R ceramic decoupling capacitor and the PLIMIT and GAIN/SLV resistor dividers.
8 GAIN/SLV I Selects Gain and selects between Master and Slave mode depending on pin voltage divider.
9 GND G Ground
10 LINP I Positive audio input for left channel. Biased at 3 V. Connect to GND for PBTL mode.
11 LINN I Negative audio input for left channel. Biased at 3 V. Connect to GND for PBTL mode.
12 MUTE I Mute signal for fast disable/enable of outputs (HIGH = outputs Hi-Z, LOW = outputs enabled). TTL logic levels with compliance to AVCC.
13 AM2 I AM Avoidance Frequency Selection
14 AM1 I AM Avoidance Frequency Selection
15 AM0 I AM Avoidance Frequency Selection
16 SYNC DIO Clock input/output for synchronizing multiple class-D devices. Direction determined by GAIN/SLV terminal.
17 AVCC P Analog Supply
18 PVCC P Power supply
19 PVCC P Power supply
20 BSNL BST Boot strap for negative left channel output, connect to 220 nF X5R, or better ceramic cap to OUTNL
21 OUTNL PO Negative left channel output
22 GND G Ground
23 OUTPL PO Positive left channel output
24 BSPL BST Boot strap for positive left channel output, connect to 220 nF X5R, or better ceramic cap to OUTPL
25 GND G Ground
26 BSNR BST Boot strap for negative right channel output, connect to 220 nF X5R, or better ceramic cap to OUTNR
27 OUTNR PO Negative right channel output
28 GND G Ground
29 OUTPR PO Positive right channel output
30 BSPR BST Boot strap for positive right channel output, connect to 220 nF X5R or better ceramic cap to OUTPR
31 PVCC P Power supply
32 PVCC P Power supply
33 PowerPAD G Connect to GND for best system performance. If not connected to GND, leave floating.
(1) TYPE: DO = Digital Output, I = Analog Input, G = General Ground, PO = Power Output, BST = Boot Strap.