SLOS810A October 2019 – August 2020 TPA3139D2
PRODUCTION DATA
FR-4 Glass Epoxy material with 1 oz. (35 µm) is recommended for use with the TPA3139D2. The use of this material can provide higher power output, improved thermal performance, and better EMI margin (due to lower PCB trace inductance). It is recommended to use several GND underneath the device thermal pad for thermal coupling to a bottom-side copper GND plane for best thermal performance.