SLOS907C April   2015  – December 2017 TPA3144D2

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Device Images
      1.      Simplified Schematic
  4. 4 Revision History
  5. 5 Device Comparison Table
  6. 6 Pin Configuration and Functions
    1.     Pin Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Switching Characteristics
    7. 7.7 Typical Characteristics
  8. 8 Parameter Measurement Information
  9. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1  Gain Setting via GAIN Pin
      2. 9.3.2  SD Operation
      3. 9.3.3  Gain Limit Control, LIMTHRES and LIMRATE
      4. 9.3.4  SPEAKERGUARD Automatic Gain Limit, AGL
      5. 9.3.5  Thermal Foldback, TFB
      6. 9.3.6  PLIMIT
      7. 9.3.7  LIMTHRES
      8. 9.3.8  Spread Spectrum and De-Phase Control
      9. 9.3.9  GVDD Supply
      10. 9.3.10 DC Detect
      11. 9.3.11 PBTL Select
      12. 9.3.12 Short-Circuit Protection and Automatic Recovery Feature
      13. 9.3.13 Thermal Protection
    4. 9.4 Device Functional Modes
  10. 10Application and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Applications
      1. 10.2.1 Design Requirements
        1. 10.2.1.1 PCB Material Recommendation
        2. 10.2.1.2 PVCC Capacitor Recommendation
        3. 10.2.1.3 Decoupling Capacitor Recommendations
      2. 10.2.2 Detailed Design Procedure
        1. 10.2.2.1 Ferrite Bead Filter Considerations
        2. 10.2.2.2 Efficiency: LC Filter Required with the Traditional Class-D Modulation Scheme
        3. 10.2.2.3 When to Use an Output Filter for EMI Suppression
        4. 10.2.2.4 Input Resistance
        5. 10.2.2.5 Input Capacitor, Ci
        6. 10.2.2.6 BSN and BSP Capacitors
        7. 10.2.2.7 Differential Inputs
        8. 10.2.2.8 Using Low-ESR Capacitors
      3. 10.2.3 Application Performance Curves
        1. 10.2.3.1 EN55013 Radiated Emissions Results
        2. 10.2.3.2 EN55022 Conducted Emissions Results
  11. 11Power Supply Recommendations
    1. 11.1 Power Supply Decoupling, CS
  12. 12Layout
    1. 12.1 Layout Guidelines
    2. 12.2 Layout Example
  13. 13Device and Documentation Support
    1. 13.1 Device Support
      1. 13.1.1 Third-Party Products Disclaimer
    2. 13.2 Documentation Support
      1. 13.2.1 Related Documentation
    3. 13.3 Community Resources
    4. 13.4 Trademarks
    5. 13.5 Electrostatic Discharge Caution
    6. 13.6 Glossary
  14. 14Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

14 Mechanical, Packaging, and Orderable Information

The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation.