SLOS907C April   2015  – December 2017 TPA3144D2

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Device Images
      1.      Simplified Schematic
  4. 4 Revision History
  5. 5 Device Comparison Table
  6. 6 Pin Configuration and Functions
    1.     Pin Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Switching Characteristics
    7. 7.7 Typical Characteristics
  8. 8 Parameter Measurement Information
  9. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1  Gain Setting via GAIN Pin
      2. 9.3.2  SD Operation
      3. 9.3.3  Gain Limit Control, LIMTHRES and LIMRATE
      4. 9.3.4  SPEAKERGUARD Automatic Gain Limit, AGL
      5. 9.3.5  Thermal Foldback, TFB
      6. 9.3.6  PLIMIT
      7. 9.3.7  LIMTHRES
      8. 9.3.8  Spread Spectrum and De-Phase Control
      9. 9.3.9  GVDD Supply
      10. 9.3.10 DC Detect
      11. 9.3.11 PBTL Select
      12. 9.3.12 Short-Circuit Protection and Automatic Recovery Feature
      13. 9.3.13 Thermal Protection
    4. 9.4 Device Functional Modes
  10. 10Application and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Applications
      1. 10.2.1 Design Requirements
        1. 10.2.1.1 PCB Material Recommendation
        2. 10.2.1.2 PVCC Capacitor Recommendation
        3. 10.2.1.3 Decoupling Capacitor Recommendations
      2. 10.2.2 Detailed Design Procedure
        1. 10.2.2.1 Ferrite Bead Filter Considerations
        2. 10.2.2.2 Efficiency: LC Filter Required with the Traditional Class-D Modulation Scheme
        3. 10.2.2.3 When to Use an Output Filter for EMI Suppression
        4. 10.2.2.4 Input Resistance
        5. 10.2.2.5 Input Capacitor, Ci
        6. 10.2.2.6 BSN and BSP Capacitors
        7. 10.2.2.7 Differential Inputs
        8. 10.2.2.8 Using Low-ESR Capacitors
      3. 10.2.3 Application Performance Curves
        1. 10.2.3.1 EN55013 Radiated Emissions Results
        2. 10.2.3.2 EN55022 Conducted Emissions Results
  11. 11Power Supply Recommendations
    1. 11.1 Power Supply Decoupling, CS
  12. 12Layout
    1. 12.1 Layout Guidelines
    2. 12.2 Layout Example
  13. 13Device and Documentation Support
    1. 13.1 Device Support
      1. 13.1.1 Third-Party Products Disclaimer
    2. 13.2 Documentation Support
      1. 13.2.1 Related Documentation
    3. 13.3 Community Resources
    4. 13.4 Trademarks
    5. 13.5 Electrostatic Discharge Caution
    6. 13.6 Glossary
  14. 14Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

11.1 Power Supply Decoupling, CS

The TPA3144D2 is a high-performance CMOS audio amplifier that requires adequate power supply decoupling to ensure that the output total harmonic distortion (THD) is as low as possible. Power supply decoupling also prevents oscillations for long lead lengths between the amplifier and the speaker. Optimum decoupling is achieved by using a network of capacitors of different types that target specific types of noise on the power supply leads. For higher frequency transients due to parasitic circuit elements such as bond wire and copper trace inductances as well as lead frame capacitance, a good quality low equivalent-series-resistance (ESR) ceramic capacitor of value between 220 pF and 1000 pF works well. This capacitor should be placed as close to the device PVCC pins and system ground (either GND pins or thermal pad) as possible. For mid-frequency noise due to filter resonances or PWM switching transients as well as digital hash on the line, another good quality capacitor typically 0.1 μF to 1 µF placed as close as possible to the device PVCC leads works best. For filtering lower frequency noise signals, a larger aluminum electrolytic capacitor of 220 μF or greater placed near the audio power amplifier is recommended. The 220-μF capacitor also serves as a local storage capacitor for supplying current during large signal transients on the amplifier outputs. The PVCC pins provide the power to the output transistors, so a 220-µF or larger capacitor should be placed on each PVCC pin. A 10-µF capacitor on the AVCC pin is adequate. Also, a small decoupling resistor between AVCC and PVCC can be used to keep high frequency class-D noise from entering the linear input amplifiers.