SLASE40D May   2015  – April 2016 TPA3251

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Device Comparison Table
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3  Recommended Operating Conditions
    4. 7.4  Thermal Information
    5. 7.5  Electrical Characteristics
    6. 7.6  Audio Characteristics (BTL)
    7. 7.7  Audio Characteristics (SE)
    8. 7.8  Audio Characteristics (PBTL)
    9. 7.9  Typical Characteristics, BTL Configuration
    10. 7.10 Typical Characteristics, SE Configuration
    11. 7.11 Typical Characteristics, PBTL Configuration
  8. 8 Parameter Measurement Information
  9. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagrams
    3. 9.3 Feature Description
      1. 9.3.1 Error Reporting
    4. 9.4 Device Protection System
      1. 9.4.1 Overload and Short Circuit Current Protection
      2. 9.4.2 DC Speaker Protection
      3. 9.4.3 Pin-to-Pin Short Circuit Protection (PPSC)
      4. 9.4.4 Overtemperature Protection OTW and OTE
      5. 9.4.5 Undervoltage Protection (UVP) and Power-on Reset (POR)
      6. 9.4.6 Fault Handling
      7. 9.4.7 Device Reset
  10. 10Application and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Applications
      1. 10.2.1 Stereo BTL Application
        1. 10.2.1.1 Design Requirements
        2. 10.2.1.2 Detailed Design Procedures
          1. 10.2.1.2.1 Decoupling Capacitor Recommendations
          2. 10.2.1.2.2 PVDD Capacitor Recommendation
          3. 10.2.1.2.3 PCB Material Recommendation
          4. 10.2.1.2.4 Oscillator
      2. 10.2.2 Application Curves
      3. 10.2.3 Typical Application, Single Ended (1N) SE
        1. 10.2.3.1 Design Requirements
        2. 10.2.3.2 Detailed Design Procedures
        3. 10.2.3.3 Application Curves
      4. 10.2.4 Typical Application, Differential (2N) PBTL
        1. 10.2.4.1 Design Requirements
        2. 10.2.4.2 Detailed Design Procedures
        3. 10.2.4.3 Application Curves
  11. 11Power Supply Recommendations
    1. 11.1 Power Supplies
      1. 11.1.1 VDD Supply
    2. 11.2 Powering Up
    3. 11.3 Powering Down
  12. 12Layout
    1. 12.1 Layout Guidelines
    2. 12.2 Layout Examples
      1. 12.2.1 BTL Application Printed Circuit Board Layout Example
      2. 12.2.2 SE Application Printed Circuit Board Layout Example
      3. 12.2.3 PBTL Application Printed Circuit Board Layout Example
  13. 13Device and Documentation Support
    1. 13.1 Documentation Support
    2. 13.2 Community Resources
    3. 13.3 Trademarks
    4. 13.4 Electrostatic Discharge Caution
    5. 13.5 Glossary
  14. 14Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4 Revision History

Changes from C Revision (June 2015) to D Revision

  • Changed the datasheet device number From: TPA3251D2 To TPA3251 Go

Changes from B Revision (June 2015) to C Revision

  • Changed from a one page Product Preview to the full datasheetGo

Changes from A Revision (June 2015) to B Revision

  • Changed Features list item From: 80 dB PSRR (BTL, No Input Signal) To: 60 dB PSRR (BTL, No Input SignalGo
  • Changed Features list item From: >112 dB (A Weighted) SNR To: >111 dB (A Weighted) SNRGo

Changes from * Revision (May 2015) to A Revision

  • Changed the Features list for Total Output Power at 1%THD+NGo
  • Changed the Features list item Advanced Integrated Feedback Design...Go
  • Changed the Features list item From: <65 µV (A-Weighted) Output Noise To: <60 µV (A-Weighted) Output NoiseGo
  • Changed the Features list for Multiple Configurations Possible:Go
  • Changed the Description Go
  • Added the Simplified Schematic Go