SLASEM8A January   2019  – March 2019 TPA3255-Q1

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Device Images
      1.      Simplified Schematic
      2.      Total Harmonic Distortion
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Electrical Characteristics
    6. 6.6  Audio Characteristics (BTL)
    7. 6.7  Audio Characteristics (SE)
    8. 6.8  Audio Characteristics (PBTL)
    9. 6.9  Typical Characteristics, BTL Configuration
    10. 6.10 Typical Characteristics, SE Configuration
    11. 6.11 Typical Characteristics, PBTL Configuration
  7. 7 Parameter Measurement Information
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagrams
    3. 8.3 Feature Description
      1. 8.3.1 Error Reporting
    4. 8.4 Device Functional Modes
      1. 8.4.1 Device Protection System
        1. 8.4.1.1 Overload and Short Circuit Current Protection
        2. 8.4.1.2 Signal Clipping and Pulse Injector
        3. 8.4.1.3 DC Speaker Protection
        4. 8.4.1.4 Pin-to-Pin Short Circuit Protection (PPSC)
        5. 8.4.1.5 Overtemperature Protection OTW and OTE
        6. 8.4.1.6 Undervoltage Protection (UVP) and Power-on Reset (POR)
        7. 8.4.1.7 Fault Handling
        8. 8.4.1.8 Device Reset
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Applications
      1. 9.2.1 Stereo BTL Application
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedures
          1. 9.2.1.2.1 Decoupling Capacitor Recommendations
          2. 9.2.1.2.2 PVDD Capacitor Recommendation
          3. 9.2.1.2.3 PCB Material Recommendation
          4. 9.2.1.2.4 Oscillator
      2. 9.2.2 Application Curves
      3. 9.2.3 Typical Application, Single Ended (1N) SE
        1. 9.2.3.1 Design Requirements
        2. 9.2.3.2 Detailed Design Procedures
        3. 9.2.3.3 Application Curves
      4. 9.2.4 Typical Application, Differential (2N) PBTL
        1. 9.2.4.1 Design Requirements
        2. 9.2.4.2 Detailed Design Procedures
        3. 9.2.4.3 Application Curves
  10. 10Power Supply Recommendations
    1. 10.1 Power Supplies
      1. 10.1.1 VDD Supply
      2. 10.1.2 GVDD_X Supply
      3. 10.1.3 PVDD Supply
    2. 10.2 Powering Up
    3. 10.3 Powering Down
    4. 10.4 Thermal Design
      1. 10.4.1 Thermal Performance
      2. 10.4.2 Thermal Performance with Continuous Output Power
      3. 10.4.3 Thermal Performance with Non-Continuous Output Power
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Examples
      1. 11.2.1 BTL Application Printed Circuit Board Layout Example
      2. 11.2.2 SE Application Printed Circuit Board Layout Example
      3. 11.2.3 PBTL Application Printed Circuit Board Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Documentation Support
    2. 12.2 Receiving Notification of Documentation Updates
    3. 12.3 Community Resources
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

10.1.2 GVDD_X Supply

The GVDD_X supply required from the system is used to power the gate-drives for the output H-bridges. Proper connection, routing, and decoupling techniques are highlighted in the TPA3255 device EVM User's Guide (SLOU441) (as well as the Application Information section and Layout Examples section) and must be followed as closely as possible for proper operation and performance. Deviation from the guidance offered in the TPA3255 device EVM User's Guide (SLOU441), which followed the same techniques as those shown in the Application Information section, may result in reduced performance, errant functionality, or even damage to the TPA3255-Q1 device.