SLOS431B March   2004  – February 2015 TPA6120A2

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Simplified Schematic
  5. 5 Revision History
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Operating Characteristics
    7. 7.7 Typical Characteristics
  8. 8 Parameter Measurement Information
  9. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1 Current-Feedback Amplifier
      2. 9.3.2 Independent Power Supplies
    4. 9.4 Device Functional Modes
  10. 10Applications and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Application
      1. 10.2.1 High Voltage, High Fidelity DAC + Headphone Amplifier Solution
        1. 10.2.1.1 Design Requirements
        2. 10.2.1.2 Detailed Design Procedure
          1. 10.2.1.2.1 Resistor Values
          2. 10.2.1.2.2 Checking For Oscillations And Instability
          3. 10.2.1.2.3 Thermal Considerations
        3. 10.2.1.3 Application Performance Plots
      2. 10.2.2 High Fidelity Smartphone Application
        1. 10.2.2.1 Design Requirements
        2. 10.2.2.2 Detailed Design Procedure
        3. 10.2.2.3 Application Performance Plots
  11. 11Power Supply Recommendations
    1. 11.1 Independent Power Supplies
    2. 11.2 Power Supply Decoupling
  12. 12Layout
    1. 12.1 Layout Guidelines
    2. 12.2 Layout Example
  13. 13Device and Documentation Support
    1. 13.1 Documentation Support
      1. 13.1.1 Related Documentation
    2. 13.2 Trademarks
    3. 13.3 Electrostatic Discharge Caution
    4. 13.4 Glossary
  14. 14Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • RGY|14
  • DWP|20
Thermal pad, mechanical data (Package|Pins)
Orderable Information

1 Features

  • SNR of 128dB A-Weighted.
  • THD of 112.5dB
  • Current-Feedback Architecture
  • Output Voltage Noise of 0.9µVrms at
    Gain = 1V/V (16Ω Load)
  • Power Supply Range: ±5V to ±15V
  • 1300V/µs Slew Rate
  • Can be configured for Single Ended or Differential Inputs
  • Independent Power Supplies for Low Crosstalk

2 Applications

  • Professional Audio Equipment
  • HiFi Smartphone
  • Consumer Home Audio Equipment
  • Headphone Drivers

3 Description

In applications requiring a high-power output, very high fidelity headphone amplifier, the TPA6120A2 replaces a costly discrete design and allows music, not the amplifier, to be heard. The TPA6120A2's current-feedback AB amplifier architecture delivers high bandwidth, extremely low noise, and up to 128dB of dynamic range.

Three key features make current-feedback amplifiers outstanding for audio. The first feature is the high slew rate that prevents odd order distortion anomalies. The second feature is current-on-demand at the output that enables the amplifier to respond quickly and linearly when necessary without risk of output distortion. When large amounts of output power are suddenly needed, the amplifier can respond extremely quickly without raising the noise floor of the system and degrading the signal-to-noise ratio. The third feature is the gain-independent frequency response that allows the full bandwidth of the amplifier to be used over a wide range of gain settings.

Device Information(1)

PART NUMBER PACKAGE BODY SIZE (NOM)
TPA6120A2 HSOP (20) 7.5mm x 12.82mm
VQFN (14) 3.5mm x 3.5mm
  1. For all available packages, see the orderable addendum at the end of the datasheet.

4 Simplified Schematic

logic_dia_los431.gif