SLOS431B March   2004  – February 2015 TPA6120A2

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Simplified Schematic
  5. 5 Revision History
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Operating Characteristics
    7. 7.7 Typical Characteristics
  8. 8 Parameter Measurement Information
  9. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1 Current-Feedback Amplifier
      2. 9.3.2 Independent Power Supplies
    4. 9.4 Device Functional Modes
  10. 10Applications and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Application
      1. 10.2.1 High Voltage, High Fidelity DAC + Headphone Amplifier Solution
        1. 10.2.1.1 Design Requirements
        2. 10.2.1.2 Detailed Design Procedure
          1. 10.2.1.2.1 Resistor Values
          2. 10.2.1.2.2 Checking For Oscillations And Instability
          3. 10.2.1.2.3 Thermal Considerations
        3. 10.2.1.3 Application Performance Plots
      2. 10.2.2 High Fidelity Smartphone Application
        1. 10.2.2.1 Design Requirements
        2. 10.2.2.2 Detailed Design Procedure
        3. 10.2.2.3 Application Performance Plots
  11. 11Power Supply Recommendations
    1. 11.1 Independent Power Supplies
    2. 11.2 Power Supply Decoupling
  12. 12Layout
    1. 12.1 Layout Guidelines
    2. 12.2 Layout Example
  13. 13Device and Documentation Support
    1. 13.1 Documentation Support
      1. 13.1.1 Related Documentation
    2. 13.2 Trademarks
    3. 13.3 Electrostatic Discharge Caution
    4. 13.4 Glossary
  14. 14Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • RGY|14
  • DWP|20
Thermal pad, mechanical data (Package|Pins)
Orderable Information

11 Power Supply Recommendations

11.1 Independent Power Supplies

The TPA6120A2 consists of two independent high-fidelity amplifiers. Each amplifier has its own voltage supply, allowing the user to leave one of the amplifiers off, saving power, reducing the generated heat, and reducing crosstalk.

Although the power supplies are independent, there are some limitations. When both amplifiers are used, the same voltage must be applied to each amplifier. For example, if the left channel amplifier is connected to a ±12-V supply, the right channel amplifier must also be connected to a ±12-V supply. If the device is connected to a different supply voltage, it may not operate properly and consistently.

When the use of only one amplifier is preferred, it must be the left amplifier. The voltage supply to the left amplifier is also responsible for internal start-up and bias circuitry of the device. Regardless of whether one or both amplifiers are used, the VCC- pins of both amplifiers must always be at the same potential.

To power down the right channel amplifier, disconnect the VCC+ pin from the power source.

The two independent power supplies can be tied together on the board to receive their power from the same source.

11.2 Power Supply Decoupling

As with any design, proper power supply decoupling is essential. Decoupling prevents noise from entering the device via the power traces and provides the extra power the device can sometimes require in a rapid fashion, preventing the device from being momentarily current-starved. Both of these functions serve to reduce distortion, leaving a clean, uninterrupted signal at the output.

Bulk decoupling capacitors should be used where the main power is brought to the board. Smaller capacitors should be placed as close as possible to the actual power pins of the device. Because the TPA6120A2 has four power pins, use four surface mount capacitors. Both types of capacitors should be low ESR.