SLOS488F November   2006  – March 2015 TPA6130A2

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Simplified Schematic
  5. 5 Revision History
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 Handling Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Operating Characteristics
    7. 7.7 Timing Requirements
    8. 7.8 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Headphone Amplifiers
    4. 8.4 Device Functional Modes
      1. 8.4.1 Hardware Shutdown
      2. 8.4.2 Software Shutdown
      3. 8.4.3 Charge Pump Enabled, HP Amplifiers Disabled
      4. 8.4.4 Hi-Z State
      5. 8.4.5 Stereo Headphone Drive
      6. 8.4.6 Dual Mono Headphone Drive
      7. 8.4.7 Bridge-Tied Load Receiver Drive
      8. 8.4.8 Default Mode
      9. 8.4.9 Volume Control
    5. 8.5 Programming
      1. 8.5.1 General I2C Operation
      2. 8.5.2 Single-and Multiple-Byte Transfers
      3. 8.5.3 Single-Byte Write
      4. 8.5.4 Multiple-Byte Write and Incremental Multiple-Byte Write
      5. 8.5.5 Single-Byte Read
      6. 8.5.6 Multiple-Byte Read
    6. 8.6 Register Maps
      1. 8.6.1 Control Register (Address: 1)
      2. 8.6.2 Volume and Mute Register (Address: 2)
      3. 8.6.3 Output Impedance Register (Address: 3)
      4. 8.6.4 I2C address and Version Register (Address: 4)
      5. 8.6.5 Reserved for test registers (Addresses: 5-8)
  9. 9 Applications and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Input-Blocking Capacitors
        2. 9.2.2.2 Charge Pump Flying Capacitor and CPVSS Capacitor
        3. 9.2.2.3 Decoupling Capacitors
        4. 9.2.2.4 I2C Control Interface Details
          1. 9.2.2.4.1 Addressing the TPA6130A2
        5. 9.2.2.5 Headphone Amplifiers
      3. 9.2.3 Application Performance Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Trademarks
    2. 12.2 Electrostatic Discharge Caution
    3. 12.3 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

13 Mechanical, Packaging, and Orderable Information

The following pages include mechanical packaging and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation.