SLOS488F November   2006  – March 2015 TPA6130A2

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Simplified Schematic
  5. 5 Revision History
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 Handling Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Operating Characteristics
    7. 7.7 Timing Requirements
    8. 7.8 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Headphone Amplifiers
    4. 8.4 Device Functional Modes
      1. 8.4.1 Hardware Shutdown
      2. 8.4.2 Software Shutdown
      3. 8.4.3 Charge Pump Enabled, HP Amplifiers Disabled
      4. 8.4.4 Hi-Z State
      5. 8.4.5 Stereo Headphone Drive
      6. 8.4.6 Dual Mono Headphone Drive
      7. 8.4.7 Bridge-Tied Load Receiver Drive
      8. 8.4.8 Default Mode
      9. 8.4.9 Volume Control
    5. 8.5 Programming
      1. 8.5.1 General I2C Operation
      2. 8.5.2 Single-and Multiple-Byte Transfers
      3. 8.5.3 Single-Byte Write
      4. 8.5.4 Multiple-Byte Write and Incremental Multiple-Byte Write
      5. 8.5.5 Single-Byte Read
      6. 8.5.6 Multiple-Byte Read
    6. 8.6 Register Maps
      1. 8.6.1 Control Register (Address: 1)
      2. 8.6.2 Volume and Mute Register (Address: 2)
      3. 8.6.3 Output Impedance Register (Address: 3)
      4. 8.6.4 I2C address and Version Register (Address: 4)
      5. 8.6.5 Reserved for test registers (Addresses: 5-8)
  9. 9 Applications and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Input-Blocking Capacitors
        2. 9.2.2.2 Charge Pump Flying Capacitor and CPVSS Capacitor
        3. 9.2.2.3 Decoupling Capacitors
        4. 9.2.2.4 I2C Control Interface Details
          1. 9.2.2.4.1 Addressing the TPA6130A2
        5. 9.2.2.5 Headphone Amplifiers
      3. 9.2.3 Application Performance Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Trademarks
    2. 12.2 Electrostatic Discharge Caution
    3. 12.3 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5 Revision History

Changes from E Revision (September 2014) to F Revision

  • Changed type from "R" to "R/W" for all bits in Register Address 1 and 2, and for bits 1 and 0 in Register Address 3 Go

Changes from D Revision (July 2014) to E Revision

  • Changed "BALL DSBGA" To "DSBGA NO." in the Pin Functions table Go
  • Changed "PIN WQFN" To "WOFN NO." in the Pin Functions table Go
  • Added the Programming sectionGo
  • Moved the General I2C Operation section through the Multiple-Byte Read section From: Device Functional Modes To: ProgrammingGo
  • Added a NOTE to the Applications and Implementation section Go
  • Added new paragraph to the Application Information section Go
  • Deleted title: Simplified Applications CircuitGo

Changes from C Revision (July 2014) to D Revision

  • Changed the datasheet title From: "TAS6130A2 138-mW DIRECTPATH™ .." To: "TPA6130A2 138-mW DIRECTPATH™.."Go

Changes from B Revision (February 2008) to C Revision

  • Added Handling Rating table, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information section. Go
  • Change the Abs Max Input voltage for RIGHTINx, LEFTINx From: –2.7 V to 3.6 V To: –2.5 V to 3.6 V Go
  • Changed TJ in the Abs Max Table From: –40°C to 125°C To: –40°C to 150°CGo
  • Added the Thermal Information tableGo
  • Corrected the y-axis scale of Figure 10Go
  • Changed Figure 45 pin 17 From: CPM To: CPN Go

Changes from A Revision (December 2006) to B Revision

  • Changed the YZH package dimensions in the AVAILABLE OPTIONS table From: 16-ball, 2 mm x 2 mm WSCP To: 16-ball, 1,98 mm x 1.98 mm (+0,01mm, –0,09 mm)Go

Changes from * Revision (November 2006) to A Revision

  • Changed Figure 34 Captions From: DirectPath To: Capless and From: Cap-Free to DirectPathGo