SLOS597B December   2008  – July 2017 TPA6132A2

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Condtions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Operating Characteristics
    7. 6.7 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Headphone Amplifiers
      2. 7.3.2 Eliminating Turn-on Pop and Power Supply Sequencing
      3. 7.3.3 RF and Power Supply Noise Immunity
      4. 7.3.4 Constant Maximum Output Power and Acoustic Shock Prevention
    4. 7.4 Device Functional Modes
      1. 7.4.1 Gain Control
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Applications
      1. 8.2.1 Configuration with Differential Input Signals
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
          1. 8.2.1.2.1 Input Coupling Capacitors
          2. 8.2.1.2.2 Charge Pump Flying Capacitor and HPVSS Capacitor
        3. 8.2.1.3 Application Curves
      2. 8.2.2 Configuration with Single-Ended Input Signals
        1. 8.2.2.1 Design Requirements
        2. 8.2.2.2 Detailed Design Procedure
        3. 8.2.2.3 Application Curves
  9. 9 Power Supply Recommendations
    1. 9.1 Power Supply and HPVDD Decoupling Capacitors
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
    3. 10.3 GND Connections
  11. 11Device and Documentation Support
    1. 11.1 Receiving Notification of Documentation Updates
    2. 11.2 Community Resources
    3. 11.3 Trademarks
    4. 11.4 Electrostatic Discharge Caution
    5. 11.5 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • RTE|16
Thermal pad, mechanical data (Package|Pins)
Orderable Information

9 Power Supply Recommendations

Connect the supply voltage to the VDD pin and decouple it with an X5R or better capacitor. Connect the HPVDD pin only to a 2.2 μF, X5R or better, capacitor. Do not connect HPVDD to an external voltage supply. Place both capacitors within 5 mm of their associated pins on the TPA6132A2. Ensure that the ground connection of each of the capacitors has a minimum length return path to the device. Failure to properly decouple the TPA6132A2 may degrade audio or EMC performance.

9.1 Power Supply and HPVDD Decoupling Capacitors

The TPA6132A2 DirectPath headphone amplifier requires adequate power supply decoupling to ensure that output noise and total harmonic distortion (THD) remain low. Use good low equivalent-series-resistance (ESR) ceramic capacitors (X5R material or better is required for best performance). Place a 2.2 μF capacitor within 5 mm of the VDD pin. Reducing the distance between the decoupling capacitor and VDD minimizes parasitic inductance and resistance, improving TPA6132A2 supply rejection performance. Use 0402 or smaller size capacitors if possible.

For additional supply rejection, connect an additional 10 μF or higher value capacitor between VDD and ground. This will help filter lower frequency power supply noise. The high power supply rejection ratio (PSRR) of the TPA6132A2 makes the 10 μF capacitor unnecessary in most applications.

Connect a 2.2 μF capacitor between HPVDD and ground. This ensures the amplifier internal bias supply remains stable and maximizes headphone amplifier performance.

WARNING

DO NOT connect HPVDD directly to VDD or an external supply voltage. The voltage at HPVDD is generated internally. Connecting HPVDD to an external voltage can damage the device.