SBOS555G June   2011  – May 2024 TPA6211A1-Q1

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
    1.     Pin Functions
    2. 4.1 DAPPER
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Operating Characteristics
    7. 5.7 Dissipation Ratings
    8.     Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Advantages of Fully Differential Amplifiers
      2. 6.3.2 Fully Differential Amplifier Efficiency and Thermal Information
      3. 6.3.3 Differential Output Versus Single-Ended Output
    4. 6.4 Device Functional Modes
  8. 7 Application and Implementation
    1. 7.1 Application Information
    2. 7.2 Typical Applications
      1. 7.2.1 Typical Differential Input Application
        1. 7.2.1.1 Design Requirements
        2. 7.2.1.2 Detailed Design Procedure
          1. 7.2.1.2.1 Resistors (RI)
          2. 7.2.1.2.2 Bypass Capacitor (CBYPASS) and Start-Up Time
          3. 7.2.1.2.3 Input Capacitor (CI)
          4. 7.2.1.2.4 Band-Pass Filter (RI, CI, and CF)
            1. 7.2.1.2.4.1 Step 1: Low-Pass Filter
            2. 7.2.1.2.4.2 Step 2: High-Pass Filter
            3. 7.2.1.2.4.3 Step 3: Additional Low-Pass Filter
          5. 7.2.1.2.5 Decoupling Capacitor (CS)
          6. 7.2.1.2.6 Using Low-ESR Capacitors
        3. 7.2.1.3 Application Curves
      2. 7.2.2 Other Application Circuits
    3. 7.3 Power Supply Recommendations
      1. 7.3.1 Power Supply Decoupling Capacitor
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
      2. 7.4.2 Layout Example
  9. 8 Device and Documentation Support
    1. 8.1 Receiving Notification of Documentation Updates
    2. 8.2 Support Resources
    3. 8.3 Trademarks
    4. 8.4 Electrostatic Discharge Caution
    5. 8.5 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

9 Revision History

Changes from Revision F (February 2024) to Revision G (May 2024)

  • Changed the ESD Ratings for CDM to ±1000VGo

Changes from Revision E (August 2019) to Revision F (February 2024)

  • Changed Device HBM ESD classification level in the Feature: Qualified for automotive applicationsGo
  • Changed the ESD Ratings for HBM to ±2000VGo

Changes from Revision D (August 2019) to Revision E (August 2019)

  • Changed packaging to HVSSOPGo
  • Changed packaging to HVSSOPGo
  • Changed packaging to HVSSOPGo

Changes from Revision C (August 2016) to Revision D (August 2019)

  • Deleted AEC-Q100 from the Feature: Qualified for automotive applicationsGo
  • Deleted Feature: Temperature Grade 2Go
  • Changed the ESD Ratings tableGo

Changes from Revision B (January 2014) to Revision C (August 2016)

  • Added Device Information table, ESD Ratings table, Feature Description section, Device Functional Modes section, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information section. Go
  • Added missing Max Ambient Temperature values to Table 6-1 Go
  • Changed 45.9 to 71.7, 1.27 to 1.25, and 91.7 to 60 in Equation 13 Go

Changes from Revision A (November 2013) to Revision B (January 2014)

  • Added three new equations to the DIFFERENTIAL OUTPUT VERSUS SINGLE-ENDED OUTPUT section in order to show difference between single-ended and differential outputGo

Changes from Revision * (June 2011) to Revision A (November 2013)

  • Deleted Designed for Wireless or Cellular Handsets and PDAs from Features list.Go
  • Deleted Ordering Information tableGo
  • Changed reference from "equation 6" to Equation 26 in the High-Pass Filter sectionGo