SBOS555G June   2011  – May 2024 TPA6211A1-Q1

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
    1.     Pin Functions
    2. 4.1 DAPPER
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Operating Characteristics
    7. 5.7 Dissipation Ratings
    8.     Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Advantages of Fully Differential Amplifiers
      2. 6.3.2 Fully Differential Amplifier Efficiency and Thermal Information
      3. 6.3.3 Differential Output Versus Single-Ended Output
    4. 6.4 Device Functional Modes
  8. 7 Application and Implementation
    1. 7.1 Application Information
    2. 7.2 Typical Applications
      1. 7.2.1 Typical Differential Input Application
        1. 7.2.1.1 Design Requirements
        2. 7.2.1.2 Detailed Design Procedure
          1. 7.2.1.2.1 Resistors (RI)
          2. 7.2.1.2.2 Bypass Capacitor (CBYPASS) and Start-Up Time
          3. 7.2.1.2.3 Input Capacitor (CI)
          4. 7.2.1.2.4 Band-Pass Filter (RI, CI, and CF)
            1. 7.2.1.2.4.1 Step 1: Low-Pass Filter
            2. 7.2.1.2.4.2 Step 2: High-Pass Filter
            3. 7.2.1.2.4.3 Step 3: Additional Low-Pass Filter
          5. 7.2.1.2.5 Decoupling Capacitor (CS)
          6. 7.2.1.2.6 Using Low-ESR Capacitors
        3. 7.2.1.3 Application Curves
      2. 7.2.2 Other Application Circuits
    3. 7.3 Power Supply Recommendations
      1. 7.3.1 Power Supply Decoupling Capacitor
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
      2. 7.4.2 Layout Example
  9. 8 Device and Documentation Support
    1. 8.1 Receiving Notification of Documentation Updates
    2. 8.2 Support Resources
    3. 8.3 Trademarks
    4. 8.4 Electrostatic Discharge Caution
    5. 8.5 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

1 Features

  • Qualified for automotive applications
    • Temperature Grade 2: –40°C to 105°C TA
    • Device HBM ESD classification level 2
    • Device CDM ESD classification level C6
  • 3.1W into 3Ω from a 5V supply at
    THD = 10% (typical)
  • Low supply current: 4mA (typical) at 5V
  • Shutdown current: 0.01µA (typical)
  • Fast startup with minimal pop
  • Only three external components
    • Improved PSRR (–80dB) and wide supply voltage (2.5V to 5.5V) for direct battery operation
    • Fully differential design reduces RF
      rectification
    • –63dB CMRR Eliminates two input
      coupling capacitors