SBOS555G June   2011  – May 2024 TPA6211A1-Q1

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
    1.     Pin Functions
    2. 4.1 DAPPER
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Operating Characteristics
    7. 5.7 Dissipation Ratings
    8.     Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Advantages of Fully Differential Amplifiers
      2. 6.3.2 Fully Differential Amplifier Efficiency and Thermal Information
      3. 6.3.3 Differential Output Versus Single-Ended Output
    4. 6.4 Device Functional Modes
  8. 7 Application and Implementation
    1. 7.1 Application Information
    2. 7.2 Typical Applications
      1. 7.2.1 Typical Differential Input Application
        1. 7.2.1.1 Design Requirements
        2. 7.2.1.2 Detailed Design Procedure
          1. 7.2.1.2.1 Resistors (RI)
          2. 7.2.1.2.2 Bypass Capacitor (CBYPASS) and Start-Up Time
          3. 7.2.1.2.3 Input Capacitor (CI)
          4. 7.2.1.2.4 Band-Pass Filter (RI, CI, and CF)
            1. 7.2.1.2.4.1 Step 1: Low-Pass Filter
            2. 7.2.1.2.4.2 Step 2: High-Pass Filter
            3. 7.2.1.2.4.3 Step 3: Additional Low-Pass Filter
          5. 7.2.1.2.5 Decoupling Capacitor (CS)
          6. 7.2.1.2.6 Using Low-ESR Capacitors
        3. 7.2.1.3 Application Curves
      2. 7.2.2 Other Application Circuits
    3. 7.3 Power Supply Recommendations
      1. 7.3.1 Power Supply Decoupling Capacitor
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
      2. 7.4.2 Layout Example
  9. 8 Device and Documentation Support
    1. 8.1 Receiving Notification of Documentation Updates
    2. 8.2 Support Resources
    3. 8.3 Trademarks
    4. 8.4 Electrostatic Discharge Caution
    5. 8.5 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7.4.1 Layout Guidelines

Place all the external components close to the TPA6211A1-Q1 device. The input resistors need to be close to the device input pins so noise does not couple on the high impedance nodes between the input resistors and the input amplifier of the device. Placing the decoupling capacitors, CS and CBYPASS, close to the TPA6211A1-Q1 device is important for the efficiency of the amplifier. Any resistance or inductance in the trace between the device and the capacitor can cause a loss in efficiency.