SLLSE96F September   2011  – October 2015 TPD12S016

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4  Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Switching Characteristics
    7. 6.7 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  Conforms to HDMI Compliance Tests Without any External Components
      2. 7.3.2  IEC 61000-4-2 ESD Protection
      3. 7.3.3  Supports HDMI 1.4 Data Rate
      4. 7.3.4  Matches Class D and Class C Pin Mapping
      5. 7.3.5  8-Channel ESD Lines for Four Differential Pairs with Ultra-low Differential Capacitance Matching (0.05 pF)
      6. 7.3.6  On-Chip Load Switch With 55-mA Current Limit Feature at the HDMI 5V_OUT Pin
      7. 7.3.7  Auto-direction Sensing I2C Level Shifter With One-Shot Circuit to Drive a Long HDMI Cable (750-pF Load)
      8. 7.3.8  Back-Drive Protection on HDMI Connector Side Ports
      9. 7.3.9  Integrated Pullup and Pulldown Resistors per HDMI Specification
      10. 7.3.10 Space Saving 24-Pin RKT Package and 24-TSSOP Package
      11. 7.3.11 DDC/CEC LEVEL SHIFT Circuit Operation
      12. 7.3.12 DDC/CEC Level Shifter Operational Notes For VCCA = 1.8 V
      13. 7.3.13 Rise-Time Accelerators
      14. 7.3.14 Noise Considerations
      15. 7.3.15 Resistor Pullup Value Selection
    4. 7.4 Device Functional Modes
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Example 1: HDMI Controller Using One Control Line
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
        3. 8.2.1.3 Application Curves
      2. 8.2.2 Example 2: HDMI Controller Using CT_HPD and LS_OE
        1. 8.2.2.1 Design Requirements
        2. 8.2.2.2 Detailed Design Procedure
        3. 8.2.2.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Examples
      1. 10.2.1 TPD12S016RKT
      2. 10.2.2 TPD12S016PW
  11. 11Device and Documentation Support
    1. 11.1 Community Resources
    2. 11.2 Trademarks
    3. 11.3 Electrostatic Discharge Caution
    4. 11.4 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • RKT|24
  • PW|24
Thermal pad, mechanical data (Package|Pins)
Orderable Information

11 Device and Documentation Support

11.1 Community Resources

The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use.

    TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers.
    Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and contact information for technical support.

11.2 Trademarks

E2E is a trademark of Texas Instruments.

All other trademarks are the property of their respective owners.

11.3 Electrostatic Discharge Caution

esds-image

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates.

11.4 Glossary

SLYZ022 — TI Glossary.

This glossary lists and explains terms, acronyms, and definitions.